Amide Solvent Label Removal for Low Temperature and pH
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Solution Overview
Problem
Conventional methods for removing adhesive labels and residues from surfaces, such as glass bottles, often require harsh cleaning conditions, high temperatures, and large amounts of cleaning solutions, leading to incomplete removal and increased costs, while also risking damage to the labels and surfaces.
Innovation Solution
The use of a cleaning composition comprising an aqueous or non-aqueous amide solvent, optionally with an additional organic solvent and less than 25 wt-% sodium hydroxide, which allows for complete removal of adhesive labels and residues at lower temperatures and caustic levels without increasing the time required, effectively penetrating and solubilizing the adhesives to remove them intact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional harsh cleaning conditions and high temperatures are used to remove adhesive labels, then complete removal is achieved, but processing costs and energy consumption increase
Solution Approach 1:
The patent changes the chemical parameters of the cleaning solution by using amide solvents (such as N-methyl-2-pyrrolidone, N,N-dimethylformamide) instead of conventional harsh chemicals, and operates at lower temperatures (50-70°C instead of higher temperatures), thereby achieving complete adhesive removal with reduced energy consumption
Solution Approach 2:
The patent replaces mechanical/thermal energy-intensive methods with a chemical solution-based approach, where the amide solvent chemically dissolves the adhesive, allowing removal at lower temperatures and reducing the need for high-energy heating and mechanical scrubbing processes
2Reliability
If conventional high caustic compositions are used to remove adhesive residues, then complete removal is achieved, but surface damage risk increases
Solution Approach 1:
The patent changes the chemical composition parameters by using amide solvents with appropriate pH levels that are effective at dissolving adhesive residues without being excessively caustic, thereby completing residue removal while minimizing surface damage risk
Solution Approach 2:
The amide solvent acts as an intermediary substance that mediates between the adhesive residue and the surface, allowing the adhesive to be dissolved and removed without direct contact between harsh caustic agents and the surface, thus protecting the surface from damage
3Productivity
If conventional cleaning solutions are used to remove labels, then removal is achieved, but label destruction creates additional buildup in cleaning solutions
Solution Approach 1:
The patent changes the chemical properties of the cleaning solution by using amide solvents that dissolve adhesives in a controlled manner, allowing labels to be removed intact rather than destroyed, thereby preventing buildup in the cleaning solution and maintaining its effectiveness throughout the process
4Ease of operation
If conventional bottle washing additives are used, then cleaning is achieved, but repeated use is required to fully remove residues
Solution Approach 1:
The patent changes the chemical composition to use amide solvents with optimized concentrations and properties that achieve complete adhesive removal in a single washing cycle, eliminating the need for repeated washing operations and reducing total processing time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves complete removal of adhesive labels and residues at reduced temperature and caustic conditions, reducing processing time and costs, while maintaining the integrity of the labels and surfaces, providing a cost-effective and efficient solution for the beverage and food industry.
Implementation Method 1
The compositions and methods remove paper and/or aluminum labels from such surfaces employing cost-effective compositions. The methods and compositions use lower caustic compositions to enable lower temperature conditions for the bottle label removal.
Implementation Method 2
The use of a cleaning composition comprising an aqueous or non-aqueous amide solvent, optionally with an additional organic solvent and less than 25 wt-% sodium hydroxide, which allows for complete removal of adhesive labels and residues at lower temperatures and caustic levels without increasing the time required, effectively penetrating and solubilizing the adhesives to remove them intact.
Data Source
AI summary
According to the invention, the compositions and methods provide for the complete removal of synthetic glues or adhesives from a plurality of surfaces through the use of amide solvents in combination with surfactants, chelants, acidulants and/or additional bottle wash additives. Beneficially, the compositions and methods are suitable for use at lower temperatures, including below 35° C., and lower pH conditions, including from 5 to 10, from 6 to 9, and from 6 to 8, in comparison to conventional caustic-based adhesive removal compositions.


