Solventless Amine-Anhydride Lamination Adhesive for Low-Temperature Curing
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Solution Overview
Problem
Conventional lamination adhesives containing isocyanates pose toxicological and allergenic risks, and there is a need for isocyanate-free systems that can cure at low temperatures while maintaining high lamination bond strength.
Innovation Solution
A two-component, solventless lamination adhesive comprising an acrylic polymer with anhydride groups reactive with primary or secondary amine groups, and a compound with multiple amine groups, which reacts to form a polymeric network without using organic solvents, water, or isocyanate groups, allowing for curing at temperatures of 40°C or lower.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If isocyanate-based lamination adhesives are used, then lamination bond strength is achieved, but toxicological and allergenic risks increase
Solution Approach 1:
The invention changes the chemical composition parameters by replacing isocyanate groups with anhydride groups in the acrylic polymer and using amine compounds as the second component. This substitution maintains the crosslinking mechanism and bond strength while eliminating the toxicological and allergenic risks associated with isocyanates.
Solution Approach 2:
The invention converts the potentially harmful isocyanate-based chemistry into a beneficial amine-anhydride reaction system. The amine-anhydride crosslinking provides equivalent or superior performance while eliminating the harmful effects, effectively turning a harmful chemical pathway into a safe and effective alternative.
2Temperature
If conventional isocyanate systems are used, then curing at low temperatures is challenging, but if alternative systems are developed, then curing at 40°C or lower is achieved
Solution Approach 1:
The invention changes the reaction chemistry parameters by selecting anhydride-functional acrylic polymers and amine compounds that exhibit high reactivity at low temperatures. The anhydride-amine crosslinking reaction proceeds efficiently at 40°C or lower, maintaining reliable curing properties while achieving the target low curing temperature.
3Ease of manufacture
If organic solvents are used in lamination adhesives, then application viscosity is adjusted, but environmental and health concerns increase
Solution Approach 1:
The invention extracts and removes organic solvents from the lamination adhesive system, creating a solvent-free formulation. The adhesive consists solely of the acrylic polymer component and amine compound component, eliminating environmental and health concerns associated with organic solvents while maintaining proper application characteristics through controlled viscosity of the neat system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive achieves a high modulus of elasticity and sufficient lamination bond strength, ensuring strong film laminates can be formed at low temperatures without the risks associated with isocyanates, while being free of organic solvents and isocyanate compounds.
Implementation Method 1
acrylic polymer A with anhydride groups which are reactive with primary or secondary amine groups, and a second component comprising at least one compound B with at least two amine groups selected from primary and secondary amine groups
Data Source
AI summary
A description is given of a method of making film laminates using a lamination adhesive comprising (a) at least one acrylic polymer A with anhydride groups which are reactive with primary or secondary amine groups; and (b) at least one compound B with at least two amine groups selected from primary and secondary amine groups. The acrylic polymer A has a molecular weight of from 3000 to 50000 and the lamination adhesive is free of organic solvents, free of water and free of compounds with isocyanate groups.