Amine-Coated Silver Particles for Flowable Stable Conductive Adhesives
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Solution Overview
Problem
Conductive adhesives containing silver particles require improved flowability and shape stability during application to ensure precise bonding between electronic components.
Innovation Solution
The silver particles are dispersed in a solvent with a specific SPAN value (V90 - V10)/V50 ranging from 0.1 to 3.3, achieved by controlling the particle size distribution and using an amine compound on the particle surface, ensuring good flowability and shape stability before sintering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If silver particles are dispersed in a solvent for conductive adhesive application, then the adhesive can be applied to member surfaces, but the particles exhibit poor flowability and shape instability before sintering
Solution Approach 1:
The patent applies parameter changes by precisely controlling the particle size distribution of silver particles, specifically setting the span value (V90-V10)/V50 to 0.05 or less. This parameter optimization enables the conductive adhesive to achieve both good flowability during application and excellent shape stability after application but before sintering, resolving the technical contradiction between these two properties.
2Stability of the object's composition
If silver particles with narrow size distribution are used to improve shape stability, then shape stability improves, but flowability may deteriorate
Solution Approach 1:
The patent optimizes the particle size distribution parameter by controlling the span value (V90-V10)/V50 to be 0.05 or less. This specific parameter setting creates a narrow size distribution that provides excellent shape stability while maintaining good flowability, effectively resolving the contradiction between these two opposing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a conductive adhesive with enhanced flowability and shape stability, enabling precise bonding and efficient sintering for electronic parts.
Implementation Method 1
V10 is the sedimentation velocity at a cumulative value of 10%; V90 is the sedimentation velocity at a cumulative value of 90%; and V50 (median sedimentation velocity) is the sedimentation velocity at a cumulative value of 50%
Implementation Method 2
the glass cell is rotated at a low speed at a centrifugal acceleration of 130 G, and data for 500 points are obtained at an interval of 5 seconds, and then the glass cell is rotated at a high speed at a centrifugal acceleration of 1160 G
Implementation Method 3
an amine compound is adhered to a surface of the silver particles
Implementation Method 4
silver particles have the property of being easily sintered by a heat treatment at low temperature in a short period of time
Data Source
AI summary
There is provided a conductive adhesive comprising silver particles dispersed in a solvent, the silver particles having good flowability, and excellent shape stability after being applied to a member and before being sintered. Silver particles dispersed in a solvent, in which an amine compound is adhered to a surface of the silver particles, and when a concentration of the silver particles in the solvent is 50% by mass, a value of SPAN as measured by a photocentrifuge method under predetermined conditions is 0.1 or more and 3.3 or less: SPAN: (V90 - V10)/V50 Equation (1), wherein when a sedimentation velocity is expressed by a cumulative distribution, V10 is the sedimentation velocity at a cumulative value of 10%; V90 is the sedimentation velocity at a cumulative value of 90%; and V50 (median sedimentation velocity) is the sedimentation velocity at a cumulative value of 50%.