Amine Curing Agent for Thermally Conductive Semiconductor EMC
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Solution Overview
Problem
Existing epoxy molding compounds (EMCs) used in semiconductor packages face limitations in thermal conductivity and mechanical properties due to the addition of high thermal conductivity inorganic fillers, leading to suboptimal heat dissipation and device stability, especially in smaller, more complex electronic devices.
Innovation Solution
An amine-based curing agent, represented by specific chemical formulas, is introduced to enhance thermal conductivity by forming domains through π-conjugation, allowing phonon transport and reducing the need for high filler content, thereby improving heat dissipation and device stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If excessive amounts of high thermal conductivity inorganic filler are used in EMC to improve thermal conductivity, then thermal conductivity of the filler increases, but mechanical properties deteriorate and thermal conductivity of the final molding does not exceed about 5 W/mK
Solution Approach 1:
The patent changes the chemical composition parameters of the curing agent by introducing aromatic rings with conjugated double bonds (A1 groups) into the amine-based curing agent structure. This structural modification enables phonon transport pathways within the polymer matrix itself, fundamentally changing how thermal energy is conducted without relying on inorganic filler particles. The conjugated systems create efficient phonon conduction channels that bypass the need for high filler loading.
Solution Approach 2:
The patent replaces the mechanical/physical thermal conduction mechanism through inorganic filler particles with a chemical/quantum mechanical mechanism through π-conjugated electron systems in the curing agent. The conjugated double bonds create delocalized electron systems that facilitate phonon transport, substituting the traditional filler-based thermal management approach with a molecular-level thermal conduction mechanism inherent to the polymer matrix.
2Temperature
If inorganic filler is increased to improve heat dissipation, then thermal conductivity may improve, but the complexity of the composition increases and manufacturing becomes more difficult
Solution Approach 1:
The patent extracts and eliminates the dependency on inorganic filler particles for thermal conduction by developing a curing agent that provides intrinsic thermal management capabilities. The aromatic amine-based curing agent with conjugated systems self-provides phonon transport pathways, removing the need for separate filler additives and simplifying the overall composition to primarily epoxy resin and curing agent components.
Solution Approach 2:
The curing agent serves multiple functions simultaneously: it cures the epoxy resin to form the crosslinked network structure while also providing thermal conduction pathways through its conjugated aromatic system. This multi-functionality eliminates the need for separate filler materials that would otherwise be required for heat dissipation, reducing composition complexity while achieving both structural and thermal management goals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The amine-based curing agent enhances thermal conductivity and heat dissipation properties in semiconductor packages while maintaining mechanical stability, even with reduced inorganic filler content, thus addressing the limitations of traditional EMCs.
Implementation Method 1
An amine-based curing agent, represented by specific chemical formulas, is introduced to enhance thermal conductivity by forming domains through π-conjugation, allowing phonon transport
Implementation Method 2
forming domains through π-conjugation, allowing phonon transport
Data Source
AI summary
An amine-based curing agent including a compound represented by Chemical Formula 1, and a composition including the curing agent, and a semiconductor package, and an electronic device prepared with the composition.The definition of Chemical Formula 1 is as described in the detailed description.