Amino Acid-Epoxy Reaction Products for Copper Electroplating Throwing Power
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Solution Overview
Problem
Current copper electroplating solutions struggle to achieve uniform metal deposits on substrates with complex geometries, such as printed circuit boards containing both through-holes and blind vias, due to inadequate throwing power and levelness of copper layers.
Innovation Solution
The use of reaction products of amino acids and epoxies as leveling agents in copper electroplating baths, which provide improved throwing power and uniformity by forming compounds that facilitate even copper or copper alloy deposition across substrates with varied features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional leveling agents are used in copper electroplating baths, then some uniformity can be achieved, but the throwing power is insufficient for narrow and tall apertures
Solution Approach 1:
The patent changes the chemical parameters of the leveling agent by using reaction products of amino acids and epoxies instead of conventional leveling agents. This chemical parameter change enables the leveling agent to simultaneously provide uniform copper deposit and sufficient throwing power for narrow and tall apertures, resolving the contradiction between uniformity and throwing power.
Solution Approach 2:
The patent employs composite chemical structures by reacting amino acids with epoxies to create novel leveling agent molecules. These composite molecular structures possess multiple functional groups that work synergistically to provide both uniform deposition and high throwing power, addressing the dual requirement contradiction.
2Manufacturing precision
If conventional leveling agents are used, then copper plating can be achieved, but the deposit is not sufficiently level across substrates with complex geometries
Solution Approach 1:
The reaction product of amino acid and epoxy provides local quality control by selectively adsorbing on different surface regions of complex geometries. The molecular structure contains functional groups that interact differently with various substrate regions, enabling uniform copper deposition across complex shapes while maintaining levelness.
Solution Approach 2:
The patent modifies the chemical parameters of the leveling agent to enhance its adaptability to complex geometries. The reaction between amino acids and epoxies creates molecules with optimized molecular weight, functional group composition, and steric properties that enable effective operation on substrates with varied features.
3Reliability
If higher throwing power is achieved, then aperture filling improves, but uniformity of copper deposit may be compromised
Solution Approach 1:
The composite molecular structure formed by amino acid-epoxy reaction provides dual functionality: the amino acid portion contributes to uniform deposition through its interaction with copper ions, while the epoxy portion enhances throwing power by affecting the electroplating kinetics. This composite structure resolves the contradiction between throwing power and uniformity.
Solution Approach 2:
The reaction product serves multiple functions simultaneously: it acts as a leveling agent for uniformity, a throwing power enhancer for aperture filling, and a deposit uniformity controller. This multi-functionality eliminates the need to trade off between throwing power and uniformity, as both are achieved by a single compound class.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described solution ensures substantially level and uniform copper or copper alloy layers with enhanced throwing power, effectively filling apertures and withstanding thermal shock stress tests, thus addressing the challenges of substrate uniformity and feature complexity.
Implementation Method 1
The present invention is directed to reaction products of amino acids and epoxies for use in copper and copper alloy electroplating baths
Data Source
AI summary
Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate copper and copper alloys with good surface properties and good physical reliability.