Amino-Modified Chip Epoxy-Polymer Coating for Probe Density
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Solution Overview
Problem
Existing chips have limitations and defects that restrict their applications in biomolecule preparation and analysis, particularly in terms of probe load density and stability.
Innovation Solution
An amino-modified chip is developed, featuring a substrate modified with an epoxy group and a polymer attached via the epoxy group, where the polymer contains primary and/or secondary amino groups. The chip also includes a probe attached to the polymer via a linker compound, enhancing probe load density and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If existing polymer-coated substrates are used for chip preparation, then the coating process is simple and reliable, but the probe load density is limited and cannot meet the requirements of advanced biomolecule analysis
Solution Approach 1:
The patent employs a composite material system consisting of a polymer coating layer containing amino groups attached to a substrate, with probes covalently bonded to the polymer through epoxy-amino group reactions. This composite structure enables higher probe load density while maintaining structural integrity and functional performance.
Solution Approach 2:
The patent modifies the chemical parameters of the substrate surface by introducing epoxy groups and amino-containing polymers, changing the surface chemistry to enable higher probe density. The degree of polymerization (10-5000) and amino group content (0.05-10 groups per structural unit) are optimized to achieve desired probe load density.
2Reliability
If existing chip substrates are used, then manufacturing is straightforward, but stability for continuous biomolecule preparation and analysis is insufficient
Solution Approach 1:
The patent applies preliminary modification to the substrate by pre-attaching epoxy groups and amino-containing polymers before probe immobilization. This preliminary action creates a stable, functionalized surface that ensures reliable probe attachment and enhances chip stability for continuous use without complicating the overall manufacturing process.
Solution Approach 2:
The amino-containing polymer acts as an intermediary layer between the substrate and the probes. This mediator layer provides stable attachment points for probes while maintaining substrate integrity, thereby enhancing chip reliability without significantly increasing manufacturing complexity.
3Quantity of substance
If higher probe density is achieved through existing methods, then probe load increases, but stability and performance deteriorate
Solution Approach 1:
The patent introduces functional groups (epoxy and amino groups) at specific locations on the substrate surface to create localized high-density probe attachment zones. This local quality enhancement allows high probe load density in critical areas while maintaining overall chip stability through controlled distribution of functional groups.
Solution Approach 2:
The patent optimizes chemical parameters including the degree of polymerization (10-5000) and amino group content (0.05-10 groups per structural unit) to achieve the optimal balance between probe load density and chip stability. These parameter changes enable high probe density without compromising reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The amino-modified chip achieves a higher probe load density and improved stability, effectively supporting advanced biomolecule preparation and analysis with enhanced performance.
Implementation Method 1
a polymer attached to the substrate via the epoxy group
Implementation Method 2
a substrate modified with an epoxy group; and a polymer attached to the substrate via the epoxy group, where at least one structural unit of the polymer contains an amino group
Implementation Method 3
The probe is bonded to the polymer via a linker compound
Implementation Method 4
the second linker compound is selected from at least one of an -NHS group, an epoxy group and an isocyanate group
Implementation Method 5
the bonding is a covalent bonding between group -DBCO and group -N 3
Data Source
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AI summary
The present application relates to an amino-modified chip, preparation method thereof and use thereof. The amino-modified chip comprises: a substrate and a high polymer, wherein the substrate is modified with epoxy groups; and the high polymer is attached onto the substrate via the epoxy groups, at least one structural unit of the high polymer contains an amino, and the amino is a primary amino or a secondary amino.