Ammonia-Free Substrate Cleaning Solution for Particle Removal
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Solution Overview
Problem
Current substrate cleaning methods face challenges such as insufficient particle removal, non-uniform film formation, film peeling issues, complex synthesis with fluorine-containing materials, particle reattachment, and substrate damage from alkaline solutions.
Innovation Solution
A substrate cleaning method using a solution comprising a polymer, an alkaline component without ammonia, and a solvent, where the alkaline component remains in the film to facilitate peeling, and a crack accelerating component to enhance film removal, using a neutral or mildly acidic remover.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fluorine-containing materials are used to form a film for particle removal, then particle removal efficiency is improved, but synthesis complexity increases
Solution Approach 1:
The invention changes the chemical composition parameters of the cleaning solution by replacing fluorine-containing materials with specific alkaline components (cyclic carboxylic acid derivatives, cyclic sulfur compounds, or their mixtures), thereby maintaining particle removal effectiveness while simplifying the synthesis process and material selection
Solution Approach 2:
The invention uses readily available, simple chemical compounds (cyclic carboxylic acid derivatives and cyclic sulfur compounds) that can be easily synthesized or purchased, replacing complex fluorine-containing materials, thus reducing both synthesis complexity and cost
2Reliability
If alkaline solution such as ammonia is used to remove or peel off the film, then film removal is achieved, but substrate damage occurs
Solution Approach 1:
The invention changes the pH parameter and chemical composition of the removing solution by using cyclic carboxylic acid derivatives or cyclic sulfur compounds instead of strong alkaline solutions like ammonia, enabling effective film removal while preventing substrate damage through milder chemical action
Solution Approach 2:
The invention converts the potential harm of strong alkaline solutions into benefit by using milder cyclic compounds that provide sufficient film removal capability without causing substrate damage, thus transforming a harmful approach into a safe one
3Reliability
If a film is formed on substrate to remove particles, then particle removal is enabled, but uniform film formation becomes difficult
Solution Approach 1:
The invention optimizes the composition parameters of the cleaning solution by combining specific ratios of cyclic carboxylic acid derivatives and cyclic sulfur compounds, which improves film formation uniformity while maintaining particle removal effectiveness
Solution Approach 2:
The invention uses a composite cleaning solution containing both cyclic carboxylic acid derivatives and cyclic sulfur compounds, which work synergistically to achieve uniform film formation and effective particle removal, overcoming the limitations of single-component solutions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively removes particles, forms uniform films, prevents particle reattachment, and avoids substrate damage, eliminating the need for complex fluorine-based materials and alkaline solutions.
Implementation Method 1
removing a solvent (C) in the substrate cleaning solution, and a polymer (A) forms a film
Implementation Method 2
the alkaline component (B) remains in the film to facilitate peeling
Implementation Method 3
applying a remover (F) on the substrate to remove the film in which the particles are held
Data Source
Figure 1(a)~1(f)
Figure 2(a)~2(f)
AI summary
To obtain a substrate cleaning solution capable of cleaning a substrate and removing particles. The present invention is a substrate cleaning solution comprising a polymer (A), an alkaline component (B), and a solvent (C), provided that the alkaline component (B) does not comprise ammonia.