AMOLED Backplane Anode Integration via Drive TFT Drain Terminal
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Solution Overview
Problem
The existing method for manufacturing active matrix organic light emitting diode (AMOLED) backplanes is complex and costly due to the requirement of multiple masking steps, resulting in low manufacturing efficiency.
Innovation Solution
A simplified method where a drain terminal of a drive TFT serves as the anode of the AMOLED, reducing the number of masking operations by eliminating the need for separate planarization and anode layers, and using a half-tone masking operation to form a pixel definition layer and photo spacers, with specific materials and processes such as excimer laser annealing and ion implantation for crystallization and doping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple masking steps are used to form separate planarization and anode layers, then the structural completeness and functional reliability are improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the planarization layer and anode layer into a single integrated layer structure. The conductive film is deposited over the entire surface including pixel regions and non-pixel regions, forming both the planarization function and anode function simultaneously. This merging eliminates the need for separate masking steps to define these layers, reducing process complexity while maintaining functional reliability through the dual-function design.
Solution Approach 2:
The single conductive layer serves multiple functions: it acts as both the planarization layer (providing surface flatness) and the anode layer (providing electrical connection). By designing this layer to perform multiple functions simultaneously, the patent reduces the number of manufacturing steps without compromising the structural completeness or electrical functionality of the AMOLED device.
2Manufacturing precision
If multiple masking operations are performed to form separate layers, then the manufacturing precision is improved, but the productivity decreases
Solution Approach 1:
The patent merges the formation of planarization layer and anode layer into a single deposition process. Instead of performing multiple masking operations to define separate layers, the conductive film is deposited once to form both functions. This single-step approach eliminates alignment errors between multiple masks while maintaining manufacturing precision through proper photoresist patterning, thereby significantly improving productivity.
Solution Approach 2:
The patent extracts the need for separate planarization and anode layer formation processes. By removing the redundant masking and deposition steps for these separate layers, the process is simplified to a single conductive film formation step. This extraction of unnecessary steps maintains the essential functions while dramatically improving manufacturing efficiency.
3Stability of the object's composition
If separate planarization and anode layers are formed, then the structural completeness is improved, but the loss of time and manufacturing cost increase
Solution Approach 1:
The patent combines the planarization layer and anode layer into a single integrated conductive layer. This merging eliminates the time required for multiple deposition and masking operations while maintaining structural completeness through the dual-function design. The single layer provides both the surface planarization needed for subsequent processing and the electrical conductivity required for anode function.
Solution Approach 2:
The conductive film is deposited early in the manufacturing process, before pixel definition and other subsequent steps. This preliminary formation of the multi-functional layer establishes both the planarization surface and electrical connection foundation early, allowing subsequent processing steps to proceed without additional time-consuming layer formation operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and improves efficiency by requiring only six masking operations compared to the prior art, resulting in a more straightforward and cost-effective production of AMOLED backplanes with a simple structure.
Implementation Method 1
conducting a crystallization process to crystallize and convert the amorphous silicon layer into a poly-silicon layer
Implementation Method 2
excimer laser annealing
Implementation Method 3
P-type heavy doping is applied to the first poly-silicon section, the second poly-silicon section, and the third poly-silicon section
Data Source
AI summary
The present invention provides method for manufacturing an AMOLED backplane and a structure thereof. The method uses a drain terminal of a drive TFT to serve as an anode of AMOLED the anode, so that compared to the prior art, the steps of forming a planarization layer and an anode layer are eliminated and also, the same half-tone masking operation is used to form a pixel definition layer and photo spacers, whereby the method for manufacturing the AMOLED backplane according to the present invention requires only six masking operations and saves three masking operations compared to the prior art, thereby effectively simplifying the manufacturing process, improving manufacturing efficiency, and saving cost. The present invention provides a structure of an AMOLED backplane, which has a simple structure, is easy to manufacture, and has a low cost.