AMOLED Backplane Heat Insulation Layer for Thermal Management
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Solution Overview
Problem
Oxide backplanes in AMOLED displays are sensitive to heat, leading to decreased display brightness, shortened service life, and uneven brightness due to heat generated during operation.
Innovation Solution
A heat insulation layer is introduced between the array of organic light emitting elements and the array of transistors, with a heat insulation layer via hole allowing connection while reducing heat conduction, and a passivation layer with corresponding via holes ensures interference avoidance and connection integrity. Additionally, a heat dissipation layer and cover plate are used to accelerate heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat insulation layer is introduced between the organic light emitting elements and transistors, then heat conduction from OLEDs to transistors is reduced, but device structure becomes more complex
Solution Approach 1:
A heat insulation layer is introduced as an intermediary component between the organic light emitting elements and the transistor array. This layer acts as a thermal barrier to reduce heat conduction from the OLEDs to the transistors, preventing performance degradation and display unevenness while maintaining the functional integrity of both components
Solution Approach 2:
The display backplane structure is segmented into distinct functional layers: the transistor array layer, the heat insulation layer, and the organic light emitting element layer. This segmentation allows each layer to perform its specific function independently, with the heat insulation layer specifically tasked with thermal management between the other two layers
2Reliability
If via holes are formed through the heat insulation layer for electrical connection, then electrical connection is maintained, but heat insulation effectiveness is reduced
Solution Approach 1:
The heat insulation layer exhibits local quality variation: it provides thermal insulation in the regions between via holes, while allowing electrical conduction through the via holes. The via holes are strategically positioned and sized to provide necessary electrical connections while minimizing their impact on the overall heat insulation performance of the layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces heat conduction from organic light emitting elements to transistors, preventing uneven display and electrode breakage, while ensuring reliable connection and enhanced heat dissipation.
Implementation Method 1
a heat insulation layer is introduced between the array of organic light emitting elements and the array of transistors, with a heat insulation layer via hole allowing connection while reducing heat conduction
Data Source
Figure 1~2
AI summary
The present invention provides a display backplane and a manufacturing method thereof, as well as a display device. The display backplane comprising: a substrate; an array of organic light emitting elements and an array of transistors for driving and controlling the array of organic light emitting elements formed on the substrate; and a heat insulation layer formed between the array of organic light emitting elements and the array of transistors, wherein the heat insulation layer is provided with a heat insulation layer via hole, through which the array of transistors is connected with the array of organic light emitting elements. The display backplane provided in the present invention can reduce the conduction of heat generated by the array of organic light emitting elements during lighting to the array of transistors, thus avoiding problems caused thereby such as uneven display.