Flexible AMOLED Substrate Bending Section Buffer Layer Reduction

The patent applies local quality by providing the buffer layer only in specific regions: on the display section and on the bending section only at positions not overlapping with the gate insulation layer. This selective placement ensures that the buffer layer provides necessary insulation where needed while avoiding areas where it would compromise bending flexibility, thus resolving the contradiction between insulation reliability and bending resistance.

The patent segments the buffer layer into distinct regions: a first buffer layer portion on the display section and a second buffer layer portion on the bending section. The second portion is specifically positioned to overlap with the flexible backing but not with the gate insulation layer. This segmentation allows different parts of the buffer layer to serve different functions, maintaining insulation where required while preserving bending capability in critical areas.

The patent ensures that the buffer layer is strategically positioned to provide insulation only where necessary. On the bending section, the buffer layer is applied only in areas that do not overlap with the gate insulation layer, creating a local insulation solution that maintains electrical isolation where needed while leaving other areas open for bending flexibility.

The buffer layer is divided into functional segments: the first portion on the display section provides comprehensive insulation, while the second portion on the bending section provides targeted insulation only where it does not interfere with bending. This segmentation resolves the contradiction by distributing insulation coverage selectively across different regions.

The patent merges the formation of the gate insulation layer and the buffer layer into a single coating process. The gate insulation layer and buffer layer are deposited simultaneously in one step, eliminating the need for separate formation processes and reducing overall fabrication complexity while maintaining proper layer alignment and insulation functionality.

The single coating process serves multiple functions: it forms both the gate insulation layer and the buffer layer in one operation. This multi-functional approach simplifies the manufacturing process by consolidating what would otherwise require separate steps, reducing device complexity while maintaining manufacturing precision through controlled deposition parameters.