AMOLED Thin Film Encapsulation Multi-Layer Structure
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Solution Overview
Problem
The existing AMOLED thin-film encapsulation structures face issues with cross-line breakage of the touch electrode layer due to a thick second ceramic layer, leading to reduced yield and product performance.
Innovation Solution
A multi-layer stacked structure for the second ceramic layer with recessed step portions at the side ends, allowing for a larger space for the touch electrode layer and reducing the risk of line breakage, and the use of a manufacturing method involving chemical vapor deposition with a mask design that includes multiple thin film layers and recessed step portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the second ceramic layer is made thick to achieve waterproof and oxygen-proof effect, then the encapsulation performance is improved, but the touch electrode layer may break due to cross-line problem
Solution Approach 1:
The second ceramic layer is divided into multiple sub-layers (second ceramic sub-layer and third ceramic sub-layer) with different thicknesses. The third ceramic sub-layer has greater thickness than the second ceramic sub-layer, creating a gradient structure that reduces stress concentration while maintaining overall encapsulation performance.
Solution Approach 2:
Different regions of the second ceramic layer have different thicknesses tailored to local requirements. The third ceramic sub-layer is thicker at the boundary region where the touch electrode layer connects, providing local stress relief where needed most, while other regions maintain appropriate thickness for encapsulation.
2Reliability
If the second ceramic layer is made thick to ensure waterproof and oxygen-proof effect, then the encapsulation performance is improved, but the yield is reduced due to touch layer breakage
Solution Approach 1:
The second ceramic layer is segmented into multiple sub-layers with varying thicknesses, allowing the structure to maintain encapsulation effectiveness while reducing stress-induced breakage of the touch electrode layer, thereby improving manufacturing yield.
Solution Approach 2:
The thickness parameter of the second ceramic layer is optimized by creating a multi-sub-layer structure with different thickness values. This parameter optimization allows the layer to provide sufficient encapsulation protection while minimizing mechanical stress on the touch electrode layer, reducing defects and improving yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layer structure effectively reduces the risk of cross-line breakage and improves the performance and reliability of the integrated touch screen, enhancing overall product performance and reducing pinhole defects.
Implementation Method 1
a manufacturing method involving chemical vapor deposition with a mask design that includes multiple thin film layers
Data Source
AI summary
A thin-film encapsulation structure of an active-matrix organic light-emitting, diode (AMOLED) is provided, and a touch electrode layer is disposed thereon. The thin-film encapsulation structure includes a first ceramic layer, an organic layer, and a second ceramic layer. The second ceramic layer has a first film layer and a second film layer; a side end of the second film layer is contracted inward so that a recessed first step portion is defined at the side end of the second film layer and a side end of the first film layer. The second ceramic layer is changed into a design of a multi-layer stacked structure, and a recessed step portion is formed at the side ends of the upper and lower layers. Therefore, the traces can be placed in a larger space and resistant to line breakage, thereby ensuring the yield and product performance.