AMOLED Insulating Layer Film Stress Alignment
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Solution Overview
Problem
In active-matrix organic light emitting diode (AMOLED) display panels, the peeling phenomenon between insulating layers can cause short circuits due to inconsistent film stresses, leading to display failures such as unevenness and white spots.
Innovation Solution
A display panel is designed with a base substrate having a first and second insulating layer, both with compressive film stresses, formed using chemical vapor deposition, where the first insulating layer includes a silicon oxide film and a silicon nitride film, and the second insulating layer consists of a silicon nitride film, ensuring consistent film stress directions to enhance bonding strength and prevent peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple stacked insulating layers are formed without patterning to simplify manufacturing, then manufacturing complexity is reduced, but film stress inconsistency causes peeling between layers leading to short circuits
Solution Approach 1:
The patent changes the stress parameter of the insulating layers by selecting specific materials (silicon oxide, silicon nitride) and controlling their deposition conditions to ensure consistent compressive stress directions. This resolves the peeling issue while maintaining the simplified stacked structure without patterning processes.
Solution Approach 2:
The patent uses composite insulating layer structures combining different materials (silicon oxide layer and silicon nitride layer) with complementary stress characteristics. The silicon nitride layer provides compressive stress to counterbalance tensile stress in other layers, preventing peeling while maintaining manufacturing simplicity.
2Device complexity
If insulating layers with thin overall thickness are used to reduce device complexity, then device structure is simplified, but peeling phenomenon occurs between adjacent layers causing display failure
Solution Approach 1:
The patent modifies the stress parameter of thin insulating layers by controlling material composition and deposition conditions. This ensures that even at reduced thickness, the layers maintain consistent stress directions and adequate bonding strength, preventing peeling while keeping the device structure simple.
Solution Approach 2:
The patent incorporates stress-compensating material layers (silicon nitride with compressive stress) in advance within the insulating layer stack. This beforehand cushioning of stress imbalances prevents peeling phenomena before they can occur during device operation, ensuring display reliability without increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces white spot defects and short circuits between signal lines and data lines, improving display uniformity and reliability by maintaining consistent film stress between insulating layers.
Implementation Method 1
depositing a silicon oxide film layer on the base substrate with a chemical vapor deposition equipment
Implementation Method 2
a direction of the film stress of the first insulating layer is the same as a direction of a film stress of the second insulating layer
Data Source
AI summary
A display panel, a method for preparing the same, and a display device are provided. The display panel, comprises a base substrate; a first insulating layer and a second insulating layer which are sequentially disposed on the base substrate, wherein a direction of a film stress of the first insulating layer is the same as a direction of a film stress of the second insulating layer.