AMOLED Packaging via Laser Sintering for Drilled Displays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional AMOLED display packaging methods fail to provide reliable adhesion between the substrate and the cover, leading to poor sealing against water vapor and oxygen, making it impossible to manufacture drilled AMOLED products.
Innovation Solution
A packaging method involving a substrate with an organic light-emitting material deposited by evaporation, followed by printing and sintering of specific packaging patterns on a cover using lasers to enhance adhesion, forming a hole in the display screen for drilled products.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If OPEN MASK evaporation method is used to deposit organic material on the entire substrate surface, then the packaging layer and organic material can be adhered together, but the adhesion is poor and water vapor and oxygen penetration occurs
Solution Approach 1:
The patent divides the packaging structure into multiple layers: inorganic packaging layer, organic packaging layer, and sealing layer. Each layer serves specific functions with the inorganic layer providing barrier properties and the organic layer providing adhesion, creating a segmented defense against water vapor and oxygen penetration.
Solution Approach 2:
The patent employs composite packaging structures combining inorganic materials (such as aluminum oxide, silicon oxide) with organic materials (such as TCTA, TAPC). This composite approach leverages the barrier properties of inorganic materials and the adhesion properties of organic materials to simultaneously improve both adhesion and penetration resistance.
2Reliability
If the conventional AMOLED packaging method is used, then the entire surface is covered with organic material, but the adhesion between substrate and cover is poor and reliability is low
Solution Approach 1:
The patent segments the packaging layers into distinct functional zones with the inorganic packaging layer positioned at the bottom for adhesion to the substrate, organic packaging layer in the middle, and sealing layer at the top. This segmentation allows each layer to be optimized for its specific function while maintaining overall manufacturing feasibility.
Solution Approach 2:
The patent applies different material properties to different locations: the inorganic packaging layer is applied to the substrate surface where strong adhesion is needed, while the organic packaging layer is applied where flexibility and sealing are required. This local optimization of material properties improves both adhesion and manufacturing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves adhesion between the substrate and the cover, preventing water vapor and oxygen penetration, thereby increasing the reliability and enabling the production of drilled AMOLED display products.
Implementation Method 1
depositing an organic light-emitting material on the substrate by evaporation
Implementation Method 2
etching the organic light-emitting material by using a first laser on the substrate
Implementation Method 3
sintering the first packaging pattern and the second packaging pattern by using a second laser on one of the substrate and the cover
Data Source
AI summary
The invention relates to a display screen and a packaging method thereof. The packaging method of the display screen comprises the following steps: providing a substrate of the display screen; evaporating an organic light-emitting material on the substrate; printing a first packaging pattern and a second packaging pattern on the cover plate of the display screen, wherein the first packaging pattern surrounds the second packaging pattern; etching the organic light-emitting material by using a first laser on the substrate; fitting the substrate and the cover plate so that the first packaging pattern and the substrate are fitted, and the second packaging pattern and the organic light-emitting material are fitted; sintering the first packaging pattern and the second packaging pattern by using a second laser on one of the substrate and the cover plate; and performing punching on the display screen.