AMOLED Patch Packaging Device Vacuum Chamber Bubble Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current patch packaging devices for curved-surface AMOLEDs often generate bubbles during the manufacturing process, leading to a low yield rate of produced patches.
Innovation Solution
A patch packaging device with a suction mechanism, air-extraction mechanism, gas-supply mechanism, and pressing mechanism that forms an enclosed chamber with a light gas, allowing the cover plate to be pressed onto the substrate while extracting air and supplying a light gas with a lower density than air, preventing bubble formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a conventional pressing machine platform is used to package AMOLED patches, then the device complexity is reduced, but bubbles are generated during pressing causing low yield rate
Solution Approach 1:
The patent applies the inert atmosphere principle by creating a vacuum environment within the packaging cavity before pressing operations. The vacuum system removes air from the cavity, replacing it with a low-pressure environment that prevents bubble formation during the pressing process. This vacuum atmosphere acts as an inert environment that eliminates the harmful effect of air pockets, thereby maintaining high yield rate while using a relatively simple pressing machine platform.
2Productivity
If multiple suction bars are used to press the substrate, then the productivity is improved, but bubbles are generated during pressing
Solution Approach 1:
The patent combines the use of multiple suction bars for high productivity with the vacuum environment principle. The vacuum system creates an air-free environment in the packaging cavity, allowing multiple suction bars to press the substrate efficiently without generating bubbles. This resolution maintains both high productivity through multiple pressing points and high reliability through the bubble-preventing vacuum atmosphere.
3Ease of manufacture
If air is present during pressing, then the pressing process is simple, but bubbles are generated reducing product quality
Solution Approach 1:
The patent applies the inert atmosphere principle by implementing a vacuum system that removes air from the packaging cavity before pressing. This creates a low-pressure, air-free environment that prevents bubble formation during the pressing process. The solution maintains ease of manufacture by using a relatively simple vacuum system integrated with the pressing machine, while significantly improving manufacturing precision by eliminating bubbles and ensuring high product quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution eliminates the need for additional bubble removal steps, as the light gas contained in bubbles rises automatically, increasing the yield rate of packaged AMOLED patches and saving energy.
Implementation Method 1
an air-extraction mechanism configured to extract air from the enclosed chamber via the air-outlet hole
Implementation Method 2
a gas-supply mechanism configured to supply a light gas having a density lower than that of the air into the enclosed chamber via the gas-inlet hole
Implementation Method 3
the light gas contained in bubbles rises automatically, increasing the yield rate of packaged AMOLED patches
Data Source
AI summary
A patch packaging method and device are provided. The method includes sucking, by a suction mechanism, a loaded cover plate; carrying, by the suction mechanism, the cover plate to move in a direction toward a cavity of a patch packaging mechanism, wherein a substrate to be attached with a patch is placed within the cavity; placing, by the suction mechanism, the cover plate into the cavity, wherein the cover plate, the substrate and side walls of the cavity form an enclosed chamber; extracting, by an air-extraction mechanism, air from the enclosed chamber via an air-outlet hole arranged in the side walls; supplying, by a gas-supply mechanism, a light gas having a density lower than that of the air into the enclosed chamber via a gas-inlet hole arranged in the side walls; and pressing, by a pressing mechanism, the enclosed chamber in such a manner that the cover plate is completely pressed onto the substrate after the light gas is extracted.