Amorphous Alloy Release Layer for Composite Copper Foil
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing composite copper foils with organic or metallic release layers face issues such as low heat resistance and surface defects like pinholes during the peeling process, leading to weakened peeling properties and potential failure to separate the ultra-thin copper layer from the carrier layer.
Innovation Solution
A composite copper foil with an amorphous alloy release layer formed by electroplating a ternary alloy of nickel, molybdenum, and tungsten, which provides a smooth surface and high peel strength, reducing pinhole defects and enabling easy peeling at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If an organic release layer is used, then the peeling property is improved at low temperatures, but the heat resistance deteriorates at high temperatures causing decomposition
Solution Approach 1:
The invention changes the material composition of the release layer from organic materials to a metallic glass alloy composition (Fe, Co, Ni, Cu, Pd, Pt, Mo, W, Rh, Ir, Ru, Os, Mn, Cr, V, Ti, Zr, Hf, Nb, Ta, Al, Si, B, P, C, N, O, S, Se, Te, and their combinations). This parameter change enables the release layer to maintain both good peeling properties and high heat resistance, as the metallic glass alloy does not decompose at high temperatures like organic materials while still providing effective release functionality.
Solution Approach 2:
The invention uses a composite metallic glass alloy material containing multiple elements (Fe, Co, Ni, Cu, Pd, Pt, Mo, W, Rh, Ir, Ru, Os, Mn, Cr, V, Ti, Zr, Hf, Nb, Ta, Al, Si, B, P, C, N, O, S, Se, Te) in specific proportions. This composite material structure combines the advantages of different metals to achieve both excellent peeling properties and high heat resistance, resolving the contradiction between ease of operation and temperature resistance.
2Temperature
If a metallic compound release layer is used, then the heat resistance is improved, but surface defects such as pinholes are generated
Solution Approach 1:
The invention changes the structural state of the metallic release layer from crystalline to amorphous (metallic glass) state. This parameter change eliminates grain boundaries and surface irregularities that cause pinholes in conventional metallic compound release layers, while maintaining high heat resistance. The amorphous structure provides a smooth surface that prevents defect formation during the copper foil manufacturing process.
Solution Approach 2:
The invention achieves uniform amorphous structure throughout the release layer, eliminating local variations and grain boundaries that would create surface defects. This local quality control ensures consistent surface smoothness and prevents pinhole formation across the entire release layer surface.
3Stability of the object's composition
If the release layer has grain boundaries, then the structural stability is improved, but surface irregularities cause pinholes in the copper layer
Solution Approach 1:
The invention changes the structural state from crystalline with grain boundaries to amorphous without grain boundaries. This parameter change resolves the contradiction by providing structural stability through the unique metallic glass structure while eliminating surface irregularities. The amorphous structure achieves stability through its homogeneous atomic arrangement rather than grain boundary networks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The amorphous alloy release layer ensures strong peel strength and reduces surface defects, allowing for reliable separation of the ultra-thin copper layer from the carrier layer even at high temperatures, enhancing the workability and quality of the composite copper foil.
Implementation Method 1
forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that includes nickel
Implementation Method 2
the ultra-thin copper layer may be peeled off using the release layer
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
Embodiments of the present invention provides a composite copper foil comprising a carrier layer, a release layer and an ultra-thin copper layer in this order, wherein the release layer comprises a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer; and provides a method of fabricating the composite copper foil.