Inorganic Amorphous Film Substrate for Gas Barrier

The invention uses a composite structure consisting of a flexible polymer film substrate combined with an inorganic gas barrier layer. The polymer substrate provides flexibility and light weight, while the inorganic layer (such as aluminum oxide, silicon oxide, or multilayer inorganic compounds) provides the necessary gas barrier property. This composite approach allows the substrate to be bent into curves while maintaining effective moisture and oxygen blocking capabilities.

The gas barrier function is segmented into multiple thin inorganic layers deposited on the polymer substrate. Each inorganic layer can be formed by separate deposition processes, allowing defects in one layer to be compensated by subsequent layers. The segmentation of the barrier function into discrete inorganic layers provides superior gas barrier performance compared to single-layer or resin-based barriers.

The gas barrier layer is merged with the substrate structure itself rather than being applied as a separate sealing component. The inorganic gas barrier layer is deposited directly onto the polymer substrate in the same manufacturing line, integrating the barrier function into the substrate fabrication process. This eliminates the need for separate sealing operations and significantly improves productivity while maintaining excellent gas barrier properties.

Multiple inorganic layers are deposited sequentially on the substrate, with each layer acting as a cushion against defects in previous layers. Pinholes, cracks, or other defects in earlier layers are covered and compensated by subsequent layers, ensuring that the overall gas barrier performance is not significantly degraded by individual layer defects. This layered approach provides redundancy and improves manufacturing robustness.