Amorphous Oxide FET for Flexible X-Ray Detection

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Solution Overview

Problem

Current sensors for detecting ionizing radiation, such as X-rays, face challenges in achieving high sensitivity, low power consumption, flexible mechanical properties, and cost-effective mass production, while also providing real-time electronic readout and high bandwidth, particularly in wearable devices.

Innovation Solution

A high mobility amorphous oxide semiconductor field effect transistor with a multilayer dielectric oxide structure on a flexible substrate, featuring a high-Z main layer and insulating layers, which increases X-ray photon absorption and sensitivity, allowing for real-time detection and monitoring of ionizing radiation with low leakage current and minimal power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If CMOS technology is used for RFID sensors, then mass production and low cost are achieved, but leakage current increases power consumption

Engineering Contradiction:
Improvepower consumptionVSAvoidmass production compatibility
Core Design Contradiction:
Use of energy by moving objectVSEase of manufacture

Solution Approach 1:

The patent changes the material parameter from conventional CMOS semiconductor to amorphous oxide semiconductor, which fundamentally alters the electrical characteristics to achieve ultra-low leakage current while remaining compatible with existing manufacturing processes. This material substitution enables sensors to operate with picowatt-level power consumption without requiring complete process redesign.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite structure combining amorphous oxide semiconductor channel layer with high-k dielectric materials (such as hafnium oxide or aluminum oxide) for the gate insulator. This composite approach leverages the high mobility and low leakage of oxide semiconductors while using high-k materials to enhance gate control efficiency, achieving both low power consumption and high sensitivity.

Inventive Principle:
Principle #40Composite materials

2Measurement precision

If high-Z dielectric layer is added to increase X-ray absorption, then sensitivity improves, but device complexity increases

Engineering Contradiction:
Improvedetection sensitivityVSAvoidmultilayer structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The high-Z dielectric layer serves multiple functions simultaneously: it acts as the gate insulator providing electrical isolation, serves as the X-ray absorption layer for sensing, and functions as part of the overall device structure. This multi-functionality eliminates the need for separate absorption layers, reducing overall device complexity while maintaining high sensitivity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent applies the high-Z dielectric material specifically in the gate insulator region where it is most needed for both electrical isolation and X-ray absorption. The material composition and thickness are optimized locally to achieve maximum X-ray attenuation while maintaining appropriate electrical properties for transistor operation.

Inventive Principle:
Principle #3Local quality

3Use of energy by moving object

If amorphous oxide semiconductor is used to reduce leakage current, then power consumption decreases, but manufacturing precision requirements increase

Engineering Contradiction:
Improvepower consumptionVSAvoidfilm deposition control
Core Design Contradiction:
Use of energy by moving objectVSManufacturing precision

Solution Approach 1:

The patent employs sputtering deposition with intentionally designed short-lived amorphous phases that are subsequently crystallized or stabilized. This approach uses relatively simple, cost-effective sputtering equipment and processes rather than requiring complex molecular beam epitaxy or atomic layer deposition systems, making the technology accessible for mass production despite the precision requirements.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device achieves high sensitivity and real-time detection of ionizing radiation with low power consumption, maintaining impedance variation post-sensing event, and is suitable for flexible, low-cost mass production, enabling effective dosimetry and wearable radiation detection.

Implementation Method 1

feature a high-Z main layer and insulating layers, which increases X-ray photon absorption and sensitivity

Methodology Applied
Scientific EffectPhotoelectric absorption: Absorption (EM radiation)

Implementation Method 2

A high mobility amorphous oxide semiconductor field effect transistor with low leakage current and minimal power consumption

Methodology Applied
Scientific EffectCharge carrier transport: Conduction (electrical)

Data Source

PatentEP3538883B1Sensitive field effect device
Publication Date: 2024.05.01 ALMA MATER STUDIORUM UNIV DI BOLOGNA
  • EP3538883B1 patent drawingFigure 1
  • EP3538883B1 patent drawingFigure 2
  • EP3538883B1 patent drawingFigure 3(a)~3(c)

AI summary

The present invention concerns a sensitive field effect device (100) comprising a semiconductor channel (110), a source electrode (120) connected to said semiconductor channel (110), a drain electrode (130) connected to said semiconductor channel (110), such that said semiconductor channel (110) is interposed between said source electrode (120) and said drain electrode (130), a gate electrode (140) and a dielectric layer (150) interposed between said gate electrode (140) and said semiconductor channel (110), characterized in that said semiconductor channel (110) is a layer and is made of an amorphous oxide and in that said sensor means (170, 171, 172, 173, 174, 175, 175) are configured to change the voltage between said gate electrode (140) and said source electrode (120) upon a sensing event capable of changing their electrical state. The present invention also concerns a sensor and a method for manufacturing said field effect device (100).