Amorphous Metal Oxide Laminate for Thin High-Voltage Insulation
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Solution Overview
Problem
Existing heat dissipation members face issues such as insufficient heat dissipation properties, cracking, and peeling due to thermal stress, and alumina films have limitations in voltage resistance and thermal expansion compatibility.
Innovation Solution
A thin amorphous metal oxide film with a specific composition (SiaAlbOcTd) is directly layered on a sheet-like metal material, formed via a chemical vapor deposition method, enhancing adhesive properties, heat dissipation, and insulation while resisting high voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hot pressing method is used to produce a zirconia-reinforced alumina plate bonded to copper foil, then insulation properties and heat resistance are improved, but the insulating layer thickness must be 150 μm or more, resulting in insufficient heat dissipation properties
Solution Approach 1:
The patent changes the production method from hot pressing to a new deposition process, and modifies the alumina composition by adding silicon and controlling impurities, enabling thin films (1-30 μm) to achieve the required insulation properties without needing thick layers
Solution Approach 2:
The patent creates a composite metal oxide film combining alumina with silicon compounds (forming an aluminosilicate system), which provides both excellent insulation properties and thermal expansion compatibility with copper substrates, enabling thin film construction
2Reliability
If ceramic materials are used to provide heat resistance and insulation, then insulation properties are improved, but the significant difference in thermal expansion properties between metal and ceramic causes internal stress, leading to cracking and peeling
Solution Approach 1:
The patent modifies the ceramic composition by incorporating silicon compounds into the alumina matrix, creating an aluminosilicate system whose thermal expansion coefficient can be tuned to match the metal substrate, reducing thermal stress
Solution Approach 2:
The patent creates a gradient composition within the metal oxide film, with silicon content varying through the thickness to optimize both adhesion to the metal substrate and insulation properties in the bulk
3Reliability
If an alumina film is formed to provide insulation, then insulation properties are improved, but voltage resistance is insufficient
Solution Approach 1:
The patent optimizes the chemical composition parameters of the metal oxide film, specifically controlling the Si/Al ratio and impurity content (Fe, Ti, Na, K) within precise ranges to maximize both insulation and voltage resistance properties
Solution Approach 2:
The patent controls the density and microstructure of the metal oxide film by adjusting deposition conditions and composition, creating a dense, low-porosity structure that prevents electrical breakdown and enhances voltage resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal oxide multilayer exhibits high insulation and heat dissipation properties, maintains adhesive strength, and withstands thermal cycling without cracking, offering improved thermal management for electronic components.
Implementation Method 1
a step of reacting the mist or droplets on a metal material in a temperature atmosphere of 150°C or more and 450°C or less to obtain a metal oxide film
Data Source
Figure 1
AI summary
Provided is an amorphous metal oxide film, wherein the metal oxide film is represented by composition formula: SiaAlbOcTd (in the formula, Si is a silicon atom; Al is an aluminum atom; O is an oxygen atom; T is at least one atom other than Si, Al, and O; a, b, c, and d represent weight ratios; a + b + c + d=100; a is 3-45; b is 5-50; c is 35-60; and d is 0.05-10), and has a thickness of 0.1-30 µm. The metal oxide film can provide a metal oxide multilayer having excellent adhesion, heat dissipation, insulation, and high-voltage resistance.