Amorphous PEKK Tie Layers for Dissimilar Substrate Adhesion

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Solution Overview

Problem

Achieving satisfactory adhesion between dissimilar layers in composite or laminate assemblies is challenging, particularly with thermoplastics that exhibit poor compatibility, leading to issues like delamination and loss of structural integrity in demanding environments.

Innovation Solution

Incorporating a tie layer of amorphous polyetherketoneketone between substrates, which can be achieved through coating, coextrusion, or other processes, to enhance interfacial adhesion, especially for crystalline and high-temperature thermoplastics that otherwise show poor bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If dissimilar layers are assembled directly without a tie layer, then device complexity is reduced, but adhesion between layers deteriorates leading to delamination

Engineering Contradiction:
Improvestructure complexityVSAvoidadhesion between layers
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

An amorphous polyetherketoneketone tie layer is introduced between dissimilar substrate layers to mediate the bonding interface. This intermediary layer provides compatible surface energy and chemical properties that enable adequate wetting and adhesion to both adjacent dissimilar substrates, preventing delamination while maintaining structural integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The assembly utilizes a composite structure comprising multiple material phases: dissimilar substrate layers combined with an amorphous polyetherketoneketone tie layer. This composite approach leverages the complementary properties of each material to achieve overall performance that neither substrate could attain alone, particularly in terms of interfacial adhesion.

Inventive Principle:
Principle #40Composite materials

2Strength

If crystalline and high-temperature thermoplastics are used to meet strength and temperature requirements, then mechanical strength is improved, but adhesion to dissimilar surfaces deteriorates

Engineering Contradiction:
Improvemechanical strengthVSAvoidadhesion to dissimilar surfaces
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The amorphous polyetherketoneketone tie layer serves as a mediator between crystalline/high-temperature thermoplastic substrates and dissimilar surfaces. The amorphous nature of the tie layer provides superior surface wetting characteristics compared to the crystalline substrates, enabling adequate adhesion while the crystalline substrates maintain the required mechanical strength and temperature resistance.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the physical state parameter of the tie layer material by using an amorphous polymer rather than a crystalline one. This parameter change (from crystalline to amorphous structure) fundamentally alters the surface properties and wetting behavior, enabling adequate adhesion to dissimilar substrates while the adjacent crystalline substrates maintain their high strength and temperature resistance properties.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of amorphous polyetherketoneketone tie layers improves mechanical properties, such as tensile and compressive strength, resistance to solvents, chemicals, and water, while preventing delamination, resulting in enhanced structural integrity of composite assemblies.

Implementation Method 1

heating the polyetherketoneketone tie layer

Methodology Applied
Scientific EffectThermal softening: Melting

Implementation Method 2

improve adhesion between the composite or laminate layers

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20190256707A1Assemblies containing polyetherketoneketone tie layers
Publication Date: 2019.08.22 ARKEMA INC
  • US20190256707A1 patent drawing

AI summary

Tie layers comprised of amorphous polyetherketoneketone are used to join substrates to form laminates and other assemblies.