Amorphous Semiconductor Chip Package Thermal Management
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Solution Overview
Problem
Integrated fan-out packages face challenges in heat dissipation due to low thermal conductivity of die attachment films, which hampers the efficient management of heat generated from integrated circuit components.
Innovation Solution
The use of high thermal conductivity thermal pastes and metallic layers in conjunction with insulating encapsulants and redistribution circuit structures to enhance heat dissipation, where thermal pastes with metallic particles and metallic layers serve as thermal conductive layers covering amorphous semiconductor portions, effectively dissipating heat and protecting components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If die attachment films are used to attach integrated circuit components, then the components can be securely mounted, but the thermal conductivity is low which hampers heat dissipation
Solution Approach 1:
The patent employs a composite thermal paste comprising a polymer matrix combined with thermally conductive particles (such as metal oxides, metal flakes, or ceramic particles). This composite structure combines the adhesive properties of the polymer with the high thermal conductivity of the particles, achieving both secure attachment and effective heat dissipation. The thermal paste is applied between the integrated circuit component and the substrate to create a thermally conductive interface that overcomes the low thermal conductivity limitation of conventional die attachment films.
2Reliability
If metallic layers are added to improve thermal conductivity, then heat dissipation is enhanced, but the device complexity increases
Solution Approach 1:
The thermal paste in the patent serves multiple functions simultaneously: it provides thermal conduction to dissipate heat, acts as an adhesive to bond the integrated circuit component to the substrate, and fills voids to ensure uniform thermal contact. This multi-functionality eliminates the need for separate metallic thermal spreader layers or additional bonding steps, thereby enhancing heat dissipation without proportionally increasing device complexity.
Solution Approach 2:
The patent modifies the thermal conductivity parameter of the interface material by incorporating thermally conductive particles with varying shapes, sizes, and concentrations into the polymer matrix. By optimizing these parameters (particle type, volume fraction, distribution), the thermal conductivity of the thermal paste can be tuned to achieve desired heat dissipation performance without requiring complex multi-layer metallic structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves heat dissipation capabilities, ensuring reliable operation under high temperatures and minimizing thermal fatigue, thereby enhancing the performance and reliability of integrated fan-out packages.
Implementation Method 1
thermal paste TP with a thermal conductivity greater than 10 W/mK... thermal paste TP and the metallic layer M1 can effectively conduct and dissipate the heat generated from the singulated integrated circuit components 200
Implementation Method 2
metallic layer M... thermal conductivity of the metallic layer M may be greater than thermal conductivity of the die attachment film DAF1
Data Source
AI summary
A chip package including an integrated circuit component, a thermal conductive layer, an insulating encapsulant and a redistribution circuit structure is provided. The integrated circuit component includes an amorphous semiconductor portion located at a back surface thereof. The thermal conductive layer covers the amorphous semiconductor portion of the integrated circuit component, wherein thermal conductivity of the thermal conductive layer is greater than or substantially equal to 10 W/mK. The insulating encapsulant laterally encapsulates the integrated circuit component and the thermal conductive layer. The redistribution circuit structure is disposed on the insulating encapsulant and the integrated circuit component, wherein the redistribution circuit structure is electrically connected to the integrated circuit component.