Amplified-Suction Chuck Chambers for Clean Warped Wafer Handling

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Solution Overview

Problem

Existing chucks face challenges in securely holding warped workpieces, such as silicon wafers, due to insufficient suction force and the need to avoid contact with non-metal materials, which is crucial in clean environments like the semiconductor industry.

Innovation Solution

A chuck design featuring internal compartments for temporary vacuum accumulation, connected via controllable conduits to a vacuum source, with distributed vacuum ports on the surface to apply amplified suction, and optional protrusions to prevent direct contact, allowing for effective acquisition and holding of warped workpieces without contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If conventional vacuum chucks are used to hold warped workpieces, then the workpiece can be acquired, but the suction force is insufficient to securely hold warped workpieces

Engineering Contradiction:
Improvesuction forceVSAvoidholding security
Core Design Contradiction:
ForceVSReliability

Solution Approach 1:

The chuck is divided into multiple independent vacuum chambers (first chamber, second chamber, third chamber) that can be controlled separately. Each chamber has its own vacuum ports and can be activated independently, allowing the suction force to be distributed and amplified across multiple zones to securely hold warped workpieces with complex geometries.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system employs dynamic control of vacuum chambers through solenoid valves that can rapidly switch between vacuum and atmospheric pressure states. This dynamic capability allows the chuck to adapt to warped workpiece shapes by selectively activating different chambers, maintaining reliable holding security despite variations in workpiece geometry.

Inventive Principle:
Principle #15Dynamics

2Reliability

If non-metal materials are used to contact the workpiece for holding, then the workpiece can be securely held, but cleanliness requirements are violated in semiconductor industry applications

Engineering Contradiction:
Improveholding securityVSAvoidcontamination
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The invention uses pure pneumatic vacuum suction through metal vacuum ports and chambers to hold the workpiece, eliminating the need for non-metal contact materials like rubber nipples. The vacuum force is generated and transmitted through metal components only, ensuring cleanliness requirements are met while maintaining secure holding of the workpiece.

Inventive Principle:
Principle #29Pneumatics and hydraulics

3Force

If multiple vacuum chambers are used to amplify suction force, then warped workpieces can be securely held, but the device complexity increases

Engineering Contradiction:
Improvesuction forceVSAvoidchamber configuration
Core Design Contradiction:
ForceVSDevice complexity

Solution Approach 1:

The multiple vacuum chambers share common structural elements and control mechanisms. The chambers can be activated in different combinations depending on the workpiece requirements, providing multi-functionality. This universal design allows the system to handle various workpiece types and warpage conditions without requiring completely different configurations, thereby managing complexity while delivering amplified suction force.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides strong and controlled suction to securely hold warped workpieces, ensuring precise handling and cleanliness by maintaining vacuum force and preventing direct contact, thus addressing the limitations of traditional chuck designs.

Implementation Method 1

vacuum is temporarily accumulated in the second compartment, such that when the valve of each of said one or more conduits is opened, the accumulated vacuum affects suction at the plurality of vacuum ports on the chuck surface to acquire and hold a workpiece

Methodology Applied
Scientific EffectVacuum suction: Pressure Gradient

Data Source

PatentUS20240293917A1Chuck for acquiring a warped workpiece by amplified suction
Publication Date: 2024.09.05 CORE FLOW LTD
  • US20240293917A1 patent drawing
  • US20240293917A1 patent drawing
  • US20240293917A1 patent drawing

AI summary

A chuck for holding a workpiece, includes one or more first compartments, each defining a first space and having a wall that forms a chuck surface with a plurality of vacuum ports on the chuck surface; a second compartment defining a second space for temporarily maintaining vacuum; one or a plurality of conduits fluidically connecting between the second compartment and each of the one or a plurality of first compartments, each of the conduits having a valve which when opens allows flow through that conduit and when closed prevents flow through that conduit; and a controller, for controlling the valves, wherein vacuum within the second compartment when the valve of each of said one or more conduits is closed is used on the vacuum ports when the valve of each of said one or more conduits is opened.