Amplifier Bonding Wire Inductance Compensation
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Solution Overview
Problem
In amplifiers with integrated transistor chips, the proximity of bonding wires leads to magnetic coupling and ununiform operation due to differences in mutual inductance, affecting signal amplitudes, phases, gain, output power, and efficiency.
Innovation Solution
The amplifier design includes a specific arrangement of bonding wires with varying lengths and positions to adjust self-inductance, ensuring uniform operation by compensating for variance in mutual inductance among wires connecting transistor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If two or more transistor chips are integrated in one package with small interval, then the size and cost of the amplifier are reduced, but coupling due to magnetic field occurs between bonding wires and ununiform operation of transistors cannot be prevented
Solution Approach 1:
The patent applies local quality by making the bonding wires have non-uniform self-inductance characteristics. Specifically, wires at different positions (end wires versus middle wires) are designed with different self-inductance values to compensate for the varying mutual inductance they experience. This local differentiation in wire properties ensures that each wire's total inductance (self-inductance plus mutual inductance) is uniformized, thereby preventing ununiform transistor operation while maintaining compact packaging.
2Ease of manufacture
If bonding wires are arranged side by side, then connection is achieved, but mutual inductance difference occurs between end wires and middle wires causing ununiform source impedance
Solution Approach 1:
The patent applies parameter changes by deliberately varying the self-inductance parameter of bonding wires based on their position. End wires are designed with higher self-inductance while middle wires have lower self-inductance. This parameter differentiation compensates for the position-dependent mutual inductance, resulting in uniform total inductance and source impedance across all wires, thereby achieving both ease of manufacture and manufacturing precision.
3Device complexity
If inductance is ununiform among bonding wires, then connection structure is simple, but gain, output electrical power, efficiency, and stability of the amplifier decrease
Solution Approach 1:
The patent maintains simple bonding wire structure while achieving uniform inductance through local quality differentiation. By adjusting the self-inductance of individual wires based on their position (higher for end wires, lower for middle wires), the design achieves uniform total inductance without complicating the overall bonding structure. This approach preserves output electrical power, efficiency, and stability while keeping the device structure simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement achieves uniform operation of transistor chips, enhancing gain, output power, and efficiency by reducing inductance variance, even when transistor chips are adjacent to each other.
Implementation Method 1
the mutual inductance is generated from coupling between the bonding wires due to a magnetic field
Implementation Method 2
coupling due to a magnetic field occurs between a first bonding wire connected with the first transistor chip and a second bonding wire connected with the second transistor chip
Data Source
AI summary
An amplifier includes: a first transistor chip including a plurality of cells and provided beside an input matching substrate; a second transistor chip including a plurality of cells and provided beside the input matching substrate; a plurality of first bonding wires connecting the input matching substrate and the first transistor chip; and a plurality of second bonding wires connecting the input matching substrate and the second transistor chip, and variance of the mutual inductance of the first bonding wires and the second bonding wires is compensated by adjusting the self-inductance of the first bonding wires and the second bonding wires.