Amplifier Circuit Cross Wiring DC Microwave Signals
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Microwave and millimeter-wave high-power monolithic integrated power amplifier circuits face challenges in achieving high output power and efficiency while minimizing energy consumption and chip size, due to limited wiring space and sensitivity issues with existing matching circuits.
Innovation Solution
The amplifier circuit employs cross wiring of direct-current and microwave signals, featuring symmetrical HEMT cell-based sub-circuits with parallel and series connections of capacitors and inductors, forming a three-dimensional cross structure to enhance design flexibility and reduce electromagnetic field discontinuity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a large line width (100 μm) is used for the feeding circuit to bear large current, then the current carrying capacity is improved, but the chip area occupied increases significantly (1/10 of radial distance)
Solution Approach 1:
The patent implements three-dimensional cross wiring between direct-current signal lines and microwave signal lines in the tail-level circuit. This spatial arrangement allows the DC feeding circuit to carry large current without increasing the planar chip area, as the cross-wiring utilizes vertical stacking rather than horizontal expansion.
2Power
If a large grid-width transistor core is used to achieve high power output, then the power output capability is improved, but the impedance transformation ratio increases making matching difficult
Solution Approach 1:
The patent employs three-dimensional cross wiring configuration in the matching circuit that combines series and parallel connections of capacitors and inductors. This spatial arrangement provides additional degrees of freedom for impedance transformation, enabling effective matching for large grid-width transistor cores with high impedance ratios.
Solution Approach 2:
The matching circuit uses a combination of series and parallel capacitors and inductors that can be dynamically adjusted. The circuit includes switches that allow reconfiguration of the matching network to adapt to different impedance requirements of large grid-width transistor cores.
3Adaptability or versatility
If traditional T and π matching circuits are used for broadband signals, then the flexibility of circuit design is improved, but the wiring space required increases which is limited by chip size
Solution Approach 1:
The patent implements three-dimensional cross wiring where direct-current signal lines and microwave signal lines cross each other in the vertical dimension. This allows compact arrangement of T and π matching circuits for broadband signals without requiring excessive planar wiring space, maintaining design flexibility within limited chip area.
4Reliability
If serially connected capacitor and parallel connected ground micro-strip are used in matching circuit, then the matching performance is improved, but the circuit sensitivity to element variations increases significantly
Solution Approach 1:
The patent segments the matching circuit into modular components with symmetrical three-dimensional cross wiring configuration. The series and parallel capacitors and inductors are arranged in a balanced structure that reduces sensitivity to individual element variations, improving manufacturing tolerance while maintaining matching performance.
Data Source
AI summary
Provided is an amplifier circuit with cross wiring of direct-current signals and microwave signals, which includes: two branch sub-circuits being mirrors with each other and a third capacitor The sub-circuit includes a direct-current feeding circuit and a microwave signal circuit. The direct-current feeding circuit further comprising: a transistor core drain power-up port (Vds) of a heterojunction field effect transistor (FET), a first micro-strip inductor, a first capacitor, a pair of third inductors, a pair of branched second inductors. The microwave signal circuit further comprising: A pair of third inductors, a pair of first capacitors, a pair of second capacitors, a pair of ground inductors, a pair of fourth inductors, a serially connected fifth inductor.