Multistage Amplifier Ground Plane Segmentation for Oscillation Control

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Solution Overview

Problem

Multistage amplifiers in high-frequency bands face instability due to feedback through a common ground plane, leading to oscillation and poor performance, as existing methods like separating chip mounting patterns are difficult to stabilize and influence by wire inductances.

Innovation Solution

An integrated circuit design with separate ground planes for each amplifier stage connected by ground lines with specific length and width ratios, where the center line length is between 10 μm to 1 mm and the width is ⅓ or less of the plane width, to control impedance and suppress feedback.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a common ground plane is used for multiple amplifier stages, then the circuit layout is simplified and manufacturing is easier, but feedback through the ground plane causes oscillation and instability

Engineering Contradiction:
Improvecircuit layout simplicityVSAvoidcircuit stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The ground plane is segmented into multiple separate ground regions, each dedicated to a specific amplifier stage. These segmented ground regions are connected through high-impedance transmission lines rather than a continuous ground plane, preventing feedback while maintaining manufacturing feasibility.

Inventive Principle:
Principle #1Segmentation

2Reliability

If chip mounting patterns are separated in units of amplifying devices to suppress oscillation, then circuit stability improves, but wire inductances influence characteristics and stabilization becomes difficult

Engineering Contradiction:
Improvecircuit stabilityVSAvoidconnection complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Each amplifier stage is provided with its own dedicated ground region with specific impedance characteristics optimized for that stage. The ground connection lines are designed with controlled impedance and specific length/width ratios to provide appropriate isolation while maintaining signal integrity.

Inventive Principle:
Principle #3Local quality

3Reliability

If ground lines with specific dimensions are used to connect separate ground planes, then feedback is suppressed and stability improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improvecircuit stabilityVSAvoidline dimension precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The ground lines are designed with specific length and width parameters that create high impedance at operating frequencies, suppressing feedback. The length is set to 10μm to 1mm and width to 1/3 or less of the ground plane width, creating resonant conditions that block feedback paths while remaining manufacturable.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration stabilizes the multistage amplifier operation by reducing reflection coefficients and maintaining high gain, while avoiding the need for separated chip mounting patterns, thus enhancing performance and miniaturization potential.

Implementation Method 1

at least one line for ground connecting the first plane and the second plane to each other, wherein the at least one line has a center line having a length of 10 μm to 1 mm, a width of the at least one line is 1⁄3 or less of a width of the first plane, and a pattern ratio which is a value obtained by dividing the length of the center line by the width of the at least one line is 1 or more

Methodology Applied
Scientific EffectElectrical Impedance: Electrical Impedance Tomography

Data Source

PatentUS10027282B2Integrated circuit
Publication Date: 2018.07.17 MITSUBISHI ELECTRIC CORP
  • US10027282B2 patent drawing
  • US10027282B2 patent drawing
  • US10027282B2 patent drawing

AI summary

According to the present invention, an integrated circuit includes a first amplifier stage, a second amplifier stage, a first signal line connecting an output of the first amplifier stage and an input of the second amplifier stage to each other, a first plane for ground connected to the first amplifier stage, a second plane for ground connected to the second amplifier stage and at least one at least one line for ground connecting the first plane and the second plane to each other, wherein the at least one line has a center line having a length of 10 μm to 1 mm, a width of the at least one line is ⅓ or less of a width of the first plane, and a pattern ratio is 1 or more.