Amplifier-Less Die-to-Die Links for mm-Wave Mixer Transmission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in achieving high bandwidth density and reducing power consumption for mm-wave/THz interconnects, often requiring discrete amplification components that increase power consumption and complexity.
Innovation Solution
The implementation of amplifier-less transceivers combined with on-package low loss transmission lines, such as copper traces or strip lines, enables efficient signal transmission between up conversion mixers and down conversion mixers without additional amplification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete amplification components are used between mixer and transmission line, then signal transmission reliability is improved, but power consumption increases and device complexity increases
Solution Approach 1:
The patent removes discrete amplification components from the signal path between mixer and transmission line. By extracting these unnecessary active components, the design achieves signal transmission reliability through direct coupling while eliminating the power consumption and complexity associated with amplifiers.
Solution Approach 2:
The transmission line is designed to directly receive and transmit signals from the mixer output without external amplification. The system uses the inherent characteristics of the transmission line and mixer output impedance matching to achieve reliable signal transmission self-sufficiently, without requiring additional active components.
2Reliability
If discrete amplification components are used between mixer and transmission line, then signal transmission reliability is improved, but device complexity increases
Solution Approach 1:
The patent extracts and removes discrete amplification components from the circuit architecture. This extraction simplifies the overall device complexity while maintaining signal transmission reliability through direct electrical coupling between mixer and transmission line.
Solution Approach 2:
The mixer output is directly coupled to the transmission line input, merging these two components into a unified signal path. This direct integration eliminates the need for separate amplification stages, reducing device complexity while preserving signal integrity through proper impedance matching.
3Use of energy by moving object
If amplifier-less transceivers with low loss transmission lines are used, then power consumption is reduced, but signal transmission distance may be limited
Solution Approach 1:
The patent optimizes transmission line parameters including characteristic impedance, conductor material, and geometric configuration to minimize signal loss. By changing these physical parameters, the design achieves extended signal transmission distance without requiring amplification, maintaining low power consumption while overcoming the distance limitation.
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
Embodiments described herein may be related to apparatuses, processes, and techniques related to a transceiver architecture for inter-die communication on-package using mm-wave/THz interconnects. In particular, amplifier-less transceivers are used in combination with on-package low loss transmission lines to provide inter-die communication. In embodiments, signals on the interconnect may be transmitted between up conversion mixers and down conversion mixers without any additional amplification. Other embodiments may be described and/or claimed.