Analog PHY Module Testing with Segmented Microbump Activation

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Solution Overview

Problem

The challenge in testing the functionality of analog physical layer modules in semiconductor dies is the inability to probe microbumps effectively due to their small size and the high current density during known good die (KGD) testing, leading to electromigration issues and power bouncing.

Innovation Solution

A segmentation method is employed where the microbumps are divided into segments, allowing sequential activation of data-lane subsets for testing, reducing power consumption and current density below the electromigration limit, thereby preventing power bouncing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If microbumps are probed during KGD testing, then functionality of analog physical layer module can be tested, but high current density causes electromigration issues and power bouncing

Engineering Contradiction:

Improvetesting reliabilityVSAvoidelectromigration and power bouncing

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the data-lane subsets into multiple segments, allowing sequential activation rather than simultaneous operation. This segmentation reduces the current density on each probe bump during testing, preventing electromigration while maintaining comprehensive test coverage across all data lanes

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent implements periodic activation of data-lane subsets through sequential testing phases. Each subset is activated in turn rather than continuously, allowing current to be distributed over time and reducing peak current density on individual probe bumps, thereby eliminating electromigration risks and power bouncing

Inventive Principle:

Principle #19Periodic action

2Productivity

If all data lanes are tested simultaneously, then testing speed is improved, but power consumption exceeds safe limits causing electromigration

Engineering Contradiction:

Improvetesting speedVSAvoidpower consumption

Core Design Contradiction:

ProductivityVSUse of energy by moving object

Solution Approach 1:

The testing process is segmented into multiple phases, with different data-lane subsets activated in each phase. This allows the testing to cover all lanes comprehensively while limiting the number of active lanes at any given moment, thus controlling power consumption within safe limits

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs periodic activation patterns where data-lane subsets are turned on and off in sequence. This temporal distribution of testing activity maintains testing productivity by systematically covering all lanes while ensuring power consumption remains below thresholds that would cause electromigration

Inventive Principle:

Principle #19Periodic action

Data Source

PatentUS20250323104A1Test methodology for analog physical layer module in semiconductor die

Publication Date: 2025.10.16 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

The present disclosure provides a method, which includes the following steps: dividing a plurality of first data bumps and a plurality of second data bumps within an analog physical layer module of a semiconductor die into a plurality of first segments and a plurality of second segments, respectively; sequentially activating and testing one or more subsets within the analog physical layer module simultaneously to obtain a respective subset test result of each subset, wherein each subset comprises one of the first segments and one of the second segments; and merging the respective subset test result of each subset to obtain an overall test result of the analog physical layer module.