Compact Analog Temperature Sensor for Digital Blocks
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Solution Overview
Problem
Existing temperature sensors for integrated chips are large, leading to high temperature gradients, poor performance, noise isolation issues, and limited placement due to their size, which hampers efficient thermal management and power consumption control in portable systems.
Innovation Solution
A compact temperature sensor design using diode-connected PNP transistors as standard digital cells, integrated with digital blocks, allowing accurate local temperature measurement and reducing power consumption, with an analog control block to process potentials from these transistors for digital code generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing temperature sensors are used, then temperature measurement function is provided, but sensor size is large causing temperature gradient and poor performance
Solution Approach 1:
The temperature sensing function is segmented into multiple small sensor units distributed across the chip. Each sensor is implemented using compact transistor circuits that can be placed close to hot spots, eliminating the need for a single large sensor and thereby reducing temperature gradient issues while maintaining measurement accuracy.
Solution Approach 2:
The patent transitions from conventional large-area sensor designs to a dimensional approach where multiple small sensors are distributed in two dimensions across the chip surface. This allows temperature measurement at multiple locations simultaneously, improving accuracy without requiring each individual sensor to be large.
2Measurement precision
If existing temperature sensors are used, then temperature measurement is achieved, but power consumption is high due to large sensor area
Solution Approach 1:
The temperature measurement function is divided into multiple small sensor units, each consuming minimal power. By segmenting the sensing function across multiple small transistors rather than using a single large sensor, the total power consumption is reduced while maintaining measurement capability through distributed sensing.
Solution Approach 2:
The patent employs simple transistor-based sensing elements that are low-cost and low-power components. These small transistor sensors consume minimal power compared to conventional sensors, enabling temperature measurement without significantly increasing overall system power consumption.
3Adaptability or versatility
If existing temperature sensors are used, then temperature sensing is provided, but placement options are limited due to large size
Solution Approach 1:
The temperature sensing function is segmented into multiple small units that can be independently placed at different locations on the chip. This segmentation enables flexible placement near hot spots or in specific regions of interest without being constrained by the need for a single large sensor area.
Solution Approach 2:
The patent implements temperature sensing with local quality by placing small sensor units at specific locations where temperature measurement is most critical, such as near hot spots or processing units. Each small sensor provides localized temperature information, enabling adaptability in placement while maintaining overall system performance.
4Measurement precision
If existing temperature sensors are used, then temperature measurement is achieved, but noise isolation and process spread issues occur
Solution Approach 1:
The patent merges multiple small temperature sensor readings into a unified temperature measurement system. By combining data from multiple distributed small sensors, the system achieves better noise isolation and reduced process spread effects compared to single large sensors, improving reliability while maintaining measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise local temperature measurement at hot spots, reduces power consumption, and allows for multiple sensors to be used to generate heat maps, improving thermal management and reducing noise sensitivity.
Implementation Method 1
A first potential is generated across the first transistor and a second potential is generated across the second transistor
Data Source
AI summary
The disclosure provides a circuit that includes an analog control block, and a plurality of temperature sensors coupled to the analog control block. At least one temperature sensor of the plurality of temperature sensors includes a first transistor coupled to a first current source. A second transistor is coupled to a second current source and to the first transistor. The analog control block measures a local temperature from a first potential generated across the first transistor and from a second potential generated across the second transistor.