Anchor Structure Packaging for Electronic Unit Alignment
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Solution Overview
Problem
The challenge in manufacturing electronic devices is maintaining accurate alignment of electronic units during the packaging process, which can lead to positional deviations and failure in forming good electrical connections due to the limitations of current bonding alignment techniques.
Innovation Solution
The introduction of an anchor structure within the protective layer of the electronic device, combined with a connecting member, helps prevent positional shifts of electronic units during the formation of the protective layer, ensuring stable electrical connections between units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If bonding alignment accuracy is improved, then electrical connection quality is improved, but positional deviations still occur during subsequent packaging processes
Solution Approach 1:
The patent applies preliminary action by forming anchor structures on the substrate before bonding the electronic units. These anchor structures serve as reference markers that pre-establish the correct positional relationships, allowing the electronic units to be accurately positioned during subsequent packaging processes without experiencing positional deviations.
Solution Approach 2:
The patent introduces anchor structures as intermediary elements between the substrate and the electronic units. These anchor structures act as mediators that maintain precise spatial relationships during the packaging process, preventing direct contact-related positional shifts between the electronic units and the substrate.
2Adaptability or versatility
If electronic units are densely packed to increase functionality, then device capability is improved, but alignment accuracy becomes more difficult to maintain
Solution Approach 1:
The patent applies segmentation by dividing the packaging process into distinct stages: first forming anchor structures, then bonding electronic units, and finally forming protective layers. This segmentation allows each stage to be optimized independently, maintaining alignment accuracy even when electronic units are densely packed.
Solution Approach 2:
The patent introduces a new dimensional reference system by forming anchor structures that extend in specific directions (first and second directions) on the substrate. This creates additional spatial references that facilitate precise alignment of electronic units in densely packed configurations.
Data Source
AI summary
An electronic device includes a protective layer, an electronic unit and at least one anchor structure disposed in the protective layer, and a connecting member disposed on the protective layer. The electronic unit includes a first electronic unit and a second electronic unit that are electrically connected through the connecting member. The at least one anchor structure is between the first electronic unit and the second electronic unit. The connecting member has a first conductive layer, and the first conductive layer contacts the surface of the first electronic unit, the surface of the anchor structure and the surface of the protective layer.