Anchored Connection Pillars for Tear-Resistant Electronic Chips
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Solution Overview
Problem
The use of connection pillars with high aspect ratios and small dimensions in electronic chips is prone to fragility, increases manufacturing costs, and risks tearing from the chip due to lateral etching during the manufacturing process.
Innovation Solution
The electronic chip design incorporates conductive pillars with a dual-part structure, where a first part protrudes from the insulating layer and a second part is buried within the substrate, anchored by multiple cylindrical elements, with an insulating layer and interface layer to enhance mechanical stability and reduce lateral etching effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If connection pillars with high aspect ratio and small dimensions are used, then the size of electronic chips is reduced, but the fragility of the connection pillars increases and the risk of tearing increases
Solution Approach 1:
The connection pillar is divided into two distinct parts: a first part projecting from the insulating layer and a second part extending into the semiconductor substrate. This segmentation allows each part to be optimized independently - the first part for electrical connection with external elements and the second part for mechanical anchoring in the substrate, thereby reducing fragility while maintaining small chip size.
Solution Approach 2:
Different regions of the connection pillar structure are given different properties. The first part has properties optimized for electrical connectivity and external bonding, while the second part has properties optimized for mechanical strength and anchoring in the substrate. The insulating layer and interface layer provide localized functional properties at specific positions.
2Shape
If connection pillars with high aspect ratio are used, then the aspect ratio is improved for compact design, but the manufacturing cost and duration increase
Solution Approach 1:
The insulating layer is formed on the substrate before the connection pillars are created. The openings are formed through this pre-existing insulating layer, and the interface layer is deposited in advance. These preliminary actions simplify subsequent manufacturing steps and reduce overall process complexity and cost.
Solution Approach 2:
The interface layer acts as an intermediary between the connection pillar and the substrate, providing improved adhesion and reducing manufacturing complexity. The insulating layer serves as an intermediary structure that facilitates the formation of openings and anchoring of the pillar second part, simplifying the overall manufacturing process.
3Ease of manufacture
If lateral etching is performed during manufacturing, then the connection pillars can be formed, but the risk of tearing the connection pillars from the chip face increases
Solution Approach 1:
The interface layer is deposited beforehand to provide a protective and adhesive interface between the connection pillar and the substrate. The insulating layer is formed in advance to provide mechanical support and electrical isolation. These layers cushion against the damaging effects of lateral etching and reduce the risk of pillar tearing during manufacturing.
Solution Approach 2:
The interface layer serves as a mediator that protects the connection pillar from direct contact with etching processes and provides strong adhesion to the substrate. The insulating layer acts as a mediator providing mechanical support during the etching process, thereby reducing the risk of pillar tearing while enabling pillar formation.
Data Source
Figure 1~3
Figure 4~6
Figure 7A~7E
AI summary
The present description relates to an electronic component (50), such as an electronic chip, comprising a semiconductor substrate (12) having first and second opposite faces (14, 16) and electrically conductive pillars (60), intended to be connected to an element external to the electronic component, an insulating layer (24) covering the second face (16) of the substrate (12), a first part of the electrically conductive pillars (60) projecting from the insulating layer (24) and a second part of the electrically conductive pillars (60) passing through the insulating layer and extending into the semiconductor substrate (12) to a depth less than the thickness of the semiconductor substrate (12).