Angle Limiting Plate Cooling for Evaporation Apparatus
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Solution Overview
Problem
In the process of manufacturing display devices using evaporation apparatuses, the emission angle limit of deposition materials can be altered due to material accumulation around the angle limiting plates and nozzles, leading to inconsistent layer formation and desired thickness.
Innovation Solution
The evaporation apparatus incorporates a design with increased head dissipation effects of angle limiting members, including cooling fins and heat exchangers, to prevent material accumulation and maintain the initial emission angle limit of the deposition materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an angle limiting plate is installed above the nozzle to limit the emission path of deposition material, then the deposition material emission angle is controlled to desired range, but deposition material accumulates around the angle limiting plate and nozzle causing emission angle limit to change
Solution Approach 1:
The angle limiting member is divided into multiple cooling zones with separate cooling channels, allowing different temperature control in different regions. This segmentation prevents uniform cooling that would cause condensation, while maintaining precise emission angle control through localized temperature management.
Solution Approach 2:
The cooling channels are pre-designed with specific configurations (including spiral and straight channels) that establish temperature gradients before deposition occurs. This preliminary thermal conditioning prevents material accumulation by maintaining appropriate temperature distribution on the angle limiting plate surface throughout the deposition process.
2Reliability
If cooling fins and heat exchangers are added to increase head dissipation effects, then material accumulation is prevented, but device complexity increases
Solution Approach 1:
The cooling channels are integrated directly into the angle limiting member structure, merging the cooling function with the emission angle control function. This eliminates the need for separate external cooling systems while maintaining emission angle stability and preventing material accumulation.
Solution Approach 2:
The angle limiting member serves multiple functions: it controls the deposition material emission angle, provides structural support, and acts as a heat dissipation component with integrated cooling channels. This multi-functionality reduces overall device complexity by combining what would otherwise be separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents material accumulation on the angle limiting members, ensuring that the emission angle limit of the deposition materials remains unchanged, thereby maintaining consistent layer formation and desired thickness in the manufacturing process.
Implementation Method 1
a design with increased head dissipation effects of angle limiting members, including cooling fins and heat exchangers
Implementation Method 2
a first heat exchanger having a plurality of first heat exchange fins, each of the plurality of the first heat exchange fins located between adjacent ones of the plurality of first cooling fins
Data Source
AI summary
An evaporation apparatus includes a lower case that accommodates a deposition material, a nozzle emitting the deposition material, a first angle limiting member including a first angle limiting plate extending in a direction that limits an angle of the deposition material emitted from the nozzle, a plurality of first cooling fins connected to a side of the first angle limiting member, and a first heat exchanger having a plurality of first heat exchange fins located between the plurality of first cooling fins.