Inductive Angle Sensor Coil Layout Without Overlap Interference
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Inductive angle sensors face interference issues between the excitation coil and the pickup coil arrangement due to overlapping conductor tracks, leading to undesired coupling of interference signals and asymmetries in the magnetic field coupling.
Innovation Solution
The chip package is positioned on the substrate in a way that the signal-carrying conductor and the turns of the excitation coil do not overlap, with the chip package arranged over at least one portion of the excitation coil turns, allowing for non-contact routing of the pickup coil arrangement's conductor tracks relative to the excitation coil turns, thereby minimizing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the chip package is arranged outside the ring-shaped excitation coil to connect the pickup coil arrangement, then the electrical connections can be established, but the connecting lines overlap or cross the turns of the excitation coil leading to interference signals
Solution Approach 1:
The patent utilizes the third dimension (vertical stacking) by implementing the excitation coil in a first metallization layer and the pickup coil arrangement with its connecting lines in a second metallization layer. This spatial separation in different planes eliminates the overlapping interference problem while maintaining all necessary electrical connections, transforming a 2D layout problem into a 3D solution.
2Measurement precision
If the pickup coil arrangement is arranged within the excitation coil in a ring-shaped manner, then the magnetic field coupling is optimized, but the connecting lines must cross the excitation coil turns causing asymmetries and interference
Solution Approach 1:
By moving the connecting lines to a different metallization layer (vertical dimension), the patent maintains the symmetric ring-shaped arrangement of the pickup coil arrangement within the excitation coil in the horizontal plane, while eliminating the asymmetries caused by crossing lines. This preserves magnetic field coupling optimization without compromising field symmetry.
3Reliability
If the connecting lines are led in different planes to avoid physical contact, then short circuits are prevented, but non-contact overlapping still causes undesired interference between coils
Solution Approach 1:
The patent implements both the excitation coil and pickup coil arrangement in different metallization layers, creating physical separation in the vertical dimension. This eliminates not only short circuit risks but also the magnetic interference caused by overlapping conductor tracks in the same plane, as the spatial separation reduces mutual inductance between the coils.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces interference between the excitation and pickup coils, enhancing the accuracy and reliability of the angle sensor by preventing unwanted coupling of magnetic flux and maintaining symmetry in the magnetic field coupling.
Implementation Method 1
The excitation coil (110) is configured to generate a magnetic field in reaction to an input signal fed in
Implementation Method 2
The pickup coil arrangement (120) is configured to generate an output signal in reaction to a magnetic field
Data Source
AI summary
A device includes a substrate with an excitation coil configured to generate a magnetic field in reaction to an input signal fed in, and with a pickup coil arrangement configured to generate an output signal in reaction to a magnetic field. The excitation coil includes one or more turns arranged around the pickup coil arrangement in a ring-shaped manner in a plan view of the substrate plane. The device further includes a chip package comprising at least one electrical connection connected to the pickup coil arrangement by means of a signal-carrying conductor. In accordance with the concept described herein, the chip package is positioned on the substrate in such a way that the signal-carrying conductor and the one or more turns of the excitation coil do not overlap in a plan view of the substrate plane.