Angle Sensor Encasement Body for Moisture Protection

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Solution Overview

Problem

Existing angle sensors face challenges in balancing mechanical stability, moisture protection, and cost-effectiveness, with current solutions either being complex and costly or inadequately sealed against moisture.

Innovation Solution

The angle sensor is encased in a single, cost-effective encasement body made of hardened compound, which provides mechanical protection and sealing against moisture, with a longitudinal water barrier in the cable inlet and additional magnetic shielding to prevent interference, while eliminating the need for a separate housing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a metal housing is used to provide mechanical stability, then mechanical strength is improved, but manufacturing complexity and cost increase due to sealing requirements

Engineering Contradiction:

Improvemechanical stabilityVSAvoidhousing complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent combines the functions of mechanical protection and moisture sealing into a single integrated encasement body made of hardened compound. This eliminates the need for separate metal housing and sealing components, reducing manufacturing complexity while maintaining mechanical stability and moisture protection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the material parameter from traditional metal housing to hardened compound encasement body. This material parameter change enables the encasement body to provide both mechanical strength and moisture sealing in a single component, simplifying the overall structure.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a metal housing with sealing is used to protect against moisture, then reliability is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improvemoisture protectionVSAvoidhousing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the moisture sealing function into the encasement body itself through the hardened compound material and its bonding to the circuit board. This eliminates the need for separate sealing components and complex assembly procedures, reducing manufacturing complexity while maintaining reliable moisture protection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent uses hardened compound as a composite material that provides both structural support and moisture sealing properties. This single material serves multiple functions, simplifying the design and manufacturing process while ensuring reliable protection against moisture.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If electronics are directly mounted to circuit board without housing, then manufacturing cost is reduced, but protection against mechanical damage and moisture is insufficient

Engineering Contradiction:

Improveproduction simplicityVSAvoidprotection adequacy

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent combines mechanical protection and moisture sealing functions into the encasement body that directly encases the circuit board. This single integrated component provides adequate protection without requiring additional housing or sealing steps, maintaining production simplicity while ensuring reliable protection.

Inventive Principle:

Principle #5Merging (Combining)

4Reliability

If a separate housing is used to protect electronics, then protection against moisture is improved, but production cost and complexity increase

Engineering Contradiction:

Improvemoisture sealingVSAvoidproduction cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the moisture sealing function into the encasement body through the hardened compound material and its direct bonding to the circuit board. This eliminates the need for separate housing and sealing components, reducing production cost and complexity while maintaining effective moisture sealing.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies production, reduces costs, and effectively protects the sensor from mechanical damage and moisture ingress while maintaining sensitivity to magnetic fields, ensuring reliable operation in varying environmental conditions.

Implementation Method 1

the encasement body adhering to the particular circuit board reliably prevents the penetration of moisture between the encasement body and the circuit board

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

the greatest risk does not come from a surge of moisture but from moisture slowly penetrating due to capillary effects e.g. through the strands of the cables connected to the electronics

Methodology Applied

Scientific EffectCapillary action: Capillary Action