Angled Carrier Embedding Conductive Traces for Printheads
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Solution Overview
Problem
Existing microfluidic devices face challenges in efficiently embedding conductive traces within a rigid carrier for fluid ejection devices, which affects the alignment and functionality of fluid ejection dies and their electrical connections.
Innovation Solution
The integration of conductive traces within a molded carrier, where the traces have an array of contact points aligned with openings on the carrier's surface, allowing for secure external connector engagement and fluidic coupling with fluid ejection dies, is achieved by forming the carrier with a specific angle between its portions and using materials like epoxy mold compounds for structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conductive traces are embedded in a rigid carrier using molding processes, then the structural integrity and alignment of the carrier are improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The patent combines multiple components (carrier, conductive traces, fluid ejection dies, and sealing structures) into a single integrated molded structure. This merging approach improves structural integrity by eliminating separate assembly steps and potential misalignment issues, while the complexity is managed through optimized molding processes that can produce the integrated structure in one operation.
Solution Approach 2:
The patent employs composite material structures, particularly in the carrier that integrates rigid support structures with flexible sealing elements. This allows the single molded component to provide both structural integrity and sealing functionality, resolving the contradiction between structural stability and manufacturing complexity.
2Reliability
If fluid ejection dies are precisely aligned with conductive traces in the carrier, then the electrical and fluidic connectivity are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates alignment features and registration structures directly into the molded carrier before the fluid ejection dies are attached. This preliminary preparation of alignment references ensures that when the dies are mounted, they automatically achieve precise alignment with the conductive traces and fluid channels, thereby improving connectivity reliability without requiring extremely high manufacturing precision in subsequent steps.
Solution Approach 2:
The patent employs a nested structure where the fluid ejection dies are positioned within recesses or cavities of the carrier, with alignment pins or registration features that guide precise positioning. This nesting approach ensures automatic alignment between the dies and the embedded conductive traces, improving electrical and fluidic connectivity while managing manufacturing precision requirements.
3Ease of operation
If the carrier is designed with multiple portions at specific angles for connector engagement, then the ease of operation is improved, but the device complexity increases
Solution Approach 1:
The patent designs the carrier with multi-functional features where single structural elements serve multiple purposes. For example, the angled portions of the carrier simultaneously provide mechanical support, guide connector engagement, and define fluid flow paths. This multi-functionality improves ease of operation for connector engagement while minimizing the increase in device complexity by avoiding redundant components.
Data Source
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AI summary
Examples include a fluid ejection device comprising a carrier, at least one fluid ejection die, and conductive traces at least partially embedded in the carrier. The carrier has a first portion and a second portion, where an angle of orientation between the first portion and the second portion is nonparallel. The first portion includes an array of openings formed through a top surface of the carrier. The second portion includes at least one die opening through a bottom surface of the carrier. The fluid ejection die is coupled to the second portion of the carrier. Fluid passages formed in a back surface of the fluid ejection die are exposed through the at least one die opening formed through the bottom surface of the carrier. The conductive traces have an array of contact points at first ends of the conductive traces. The array of contact points align with the array of openings of the first portion of the carrier such that the array of contact points are exposed through the array of openings. The conductive traces connect the fluid ejection die and the array of contact points.