Angled Conductive Element for EMI Shielding in Semiconductor Packages
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Solution Overview
Problem
As semiconductor packages operate at higher speeds and smaller sizes, they face challenges with electromagnetic shielding due to increased electromagnetic interference (EMI) from high-frequency signal transitions, which worsens in high-density device distributions, and existing conformal shielding methods have limitations in production throughput and cost.
Innovation Solution
A semiconductor package design featuring a conductive element with a principal axis angled less than 90 degrees, positioned on a substrate and encapsulated with a conductive layer, which serves as conformal shielding without the need for laser drilling, allowing for efficient integration and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional conformal shielding methods using plastic encapsulants and conductive materials with sputtering or spraying are used, then electromagnetic shielding is achieved, but production throughput is low and manufacturing costs are high
Solution Approach 1:
The conductive elements are pre-formed and prepared before being placed on the substrate. This preliminary preparation allows for faster integration during assembly compared to conventional methods that require sputtering or spraying conductive materials during the manufacturing process, thereby improving production throughput while maintaining effective electromagnetic shielding
Solution Approach 2:
The patent replaces the conventional sputtering or spraying processes with a mechanical placement method using pick-and-place technology. This substitution eliminates the need for complex vacuum deposition equipment and multi-step processes, enabling faster production while achieving the same electromagnetic shielding effect through pre-formed conductive elements
2Object-affected harmful factors
If conventional conformal shielding methods using sputtering or spraying are used, then electromagnetic shielding is achieved, but manufacturing costs are high
Solution Approach 1:
The patent uses inexpensive, pre-formed conductive elements that can be easily manufactured and replaced. These elements are placed using standard pick-and-place equipment rather than requiring expensive sputtering or spraying processes, significantly reducing manufacturing costs while maintaining effective electromagnetic shielding performance
Solution Approach 2:
The patent replaces expensive vacuum deposition processes (sputtering or spraying) with a simple mechanical placement process. This substitution eliminates the need for costly equipment and complex process control, reducing manufacturing costs while achieving the same shielding effect through pre-formed conductive elements that are placed and encapsulated
3Speed
If semiconductor packages are designed with higher clock speeds and smaller sizes, then operation speed increases, but electromagnetic interference increases
Solution Approach 1:
The patent applies electromagnetic shielding locally around specific high-speed signal paths and sensitive components using conductive elements positioned at critical locations. This localized approach provides targeted EMI protection for high-speed operations without requiring complete encapsulation, maintaining design flexibility while mitigating electromagnetic interference in high-clock-speed, small-size packages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively mitigates EMI by providing conformal shielding while optimizing production efficiency and reducing manufacturing costs, enhancing the performance and reliability of high-density semiconductor packages.
Implementation Method 1
Placing the conductive element includes picking the conductive element using an electrostatic force, and releasing the conductive element on a position on the surface of the substrate
Data Source
AI summary
A semiconductor package including a substrate having a surface, and a conductive element on the first surface and electrically coupled to the substrate. The conductive element has a principal axis forming an angle less than 90 degrees with the surface.