Angled Connector Contacts for High-Density Crosstalk Control
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Solution Overview
Problem
Existing electrical connectors face challenges in managing high pin densities and crosstalk while maintaining signal integrity and mechanical stability, particularly due to offset contacts that are difficult to manufacture and load, and require backward compatibility with previous connectors.
Innovation Solution
The use of angled contacts in the electrical connector system, with signal and ground contacts angled relative to the mounting end plane, creating a staggered footprint to reduce crosstalk and distribute loading forces, while maintaining a compatible mating interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If contacts are offset to create different patterns at mating end and mounting end, then crosstalk is reduced, but manufacturing and loading become difficult due to offset forces tilting contacts
Solution Approach 1:
The patent introduces a third dimension by angling the contacts relative to the mounting end plane. Instead of simple lateral offset, contacts are positioned at an angle θ, creating a staggered three-dimensional footprint. This angular positioning in the vertical dimension allows crosstalk reduction while maintaining manufacturability, as the contacts can be loaded along their angled axes without experiencing tilting forces.
Solution Approach 2:
The patent employs asymmetric contact positioning where contacts are angled at specific orientations (e.g., 45 degrees) relative to the mounting end plane. This asymmetric angular arrangement creates different effective spacing between adjacent contacts, reducing crosstalk while the symmetry of the angular design itself facilitates uniform manufacturing and loading processes.
2Quantity of substance
If pin density is increased to fit more components in less space, then component density improves, but signal integrity and crosstalk control become more difficult
Solution Approach 1:
By utilizing the angular dimension, the patent effectively increases the spacing between adjacent contacts in the horizontal plane while maintaining the same physical footprint. The angled contacts create a staggered pattern where the effective distance between contact points is increased, reducing capacitive coupling and crosstalk even as pin density increases.
Solution Approach 2:
The patent applies different angular orientations to different contact pairs within the same connector. Signal contacts may be angled at 45 degrees while ground contacts have different orientations, creating locally optimized crosstalk reduction for each signal pair while maintaining overall high pin density.
3Quantity of substance
If contact spacing is reduced to increase pin density, then more contacts fit in the connector, but impedance control and crosstalk become problematic
Solution Approach 1:
The angular contact configuration extends the effective electrical path length between contact points while reducing the horizontal spacing. This three-dimensional arrangement allows tighter pin density while maintaining adequate signal integrity and impedance control, as the angled path provides natural spacing that reduces electromagnetic interference.
Data Source
AI summary
An electrical connector for use in an electrical connector system which controls cross talk and signal radiation. The electrical connector having a plurality of modules with mating ends and mounting ends. Signal contacts have signal mating contact receiving sections proximate the mating ends and signal circuit board mounting sections proximate the mounting ends. The signal contacts are angled relative to a plane of the mounting ends of the modules, wherein the signal mating contact receiving sections are offset from the signal circuit board mounting section. Ground contacts have ground mating contact receiving sections proximate the mating ends and ground circuit board mounting sections proximate the mounting ends. The ground contacts are angled relative to the plane of the mounting ends of the modules, wherein the ground mating contact receiving sections are offset from the ground circuit board mounting sections.