Angled Cooling Fin Arrangement for Electronic Housing
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Solution Overview
Problem
Conventional electronic assembly cooling fin arrangements are inefficient due to poor air exchange in both horizontal and vertical orientations, leading to inadequate cooling capacity and potential component failure from overheating.
Innovation Solution
The electronic assembly features cooling fins divided into two groups arranged at an angle between 45 degrees and 135 degrees, with a cooling fin-free area that narrows along the symmetry axis, allowing improved air flow and efficient cooling in both vertical and horizontal mounting positions, supplemented by lateral cooling fins for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If cooling fins are arranged horizontally or vertically in conventional orientations, then the manufacturing process is simplified, but air exchange is impeded and cooling performance deteriorates
Solution Approach 1:
The cooling fins are arranged asymmetrically at angles between 45-135 degrees relative to the housing edges, breaking the conventional horizontal/vertical symmetry. This asymmetric arrangement optimizes air exchange by creating favorable airflow paths while maintaining manufacturing feasibility through standardized fin geometries and systematic positioning.
Solution Approach 2:
The invention transitions from conventional one-dimensional horizontal or vertical fin arrangements to a two-dimensional angular arrangement. By positioning fins at oblique angles (45-135 degrees) relative to housing edges, the design creates multi-directional airflow paths that enhance cooling performance while maintaining manufacturing simplicity through systematic angular positioning.
2Reliability
If cooling fins are arranged in four groups extending from the center point, then airflow paths are available for cooling, but the cooling efficiency is limited due to air stagnation in the central area
Solution Approach 1:
The invention extracts the problematic central stagnation area by arranging cooling fins in two groups that form a V-shape with a fin-free area at the vertex. This removes the source of air stagnation and creates a dedicated airflow channel that guides cool air directly across the housing surface, eliminating the inefficiency of the four-group central arrangement.
Solution Approach 2:
The cooling fin arrangement is segmented into two distinct groups positioned at angles to each other, creating separate airflow zones. This segmentation allows independent optimization of airflow paths in different regions, preventing the air stagnation that occurs in the central area of four-group arrangements while maintaining comprehensive cooling coverage.
3Reliability
If cooling fins are arranged vertically to improve air exchange, then cooling performance improves at the lower end, but the top area experiences overheating due to heated air accumulation
Solution Approach 1:
The asymmetric angular arrangement of cooling fins (45-135 degrees) creates non-uniform airflow distribution that compensates for thermal stratification. The angled fins direct airflow across different vertical zones, ensuring that heated air at the top is effectively replaced by cooler air entering through the V-shaped channel, thereby reducing temperature gradients.
Solution Approach 2:
The fin-free area at the vertex of the V-shaped arrangement creates a localized region of enhanced airflow that penetrates deep into the housing. This local quality enhancement ensures that cool air is supplied directly to areas that would otherwise be starved of cooling, balancing the temperature distribution across the entire housing surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform cooling across the entire surface, optimizing air flow and increasing the cooling capacity, reducing the risk of component failure and allowing for more flexible printed circuit board design and improved component lifespan.
Implementation Method 1
convection, which influences air exchange along the cooling surfaces of the cooling fins
Data Source
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AI summary
The invention relates to an electronic assembly with a housing, wherein a plurality of cooling fins are provided on an outer surface of the housing, extending in different directions. According to the invention, the plurality of cooling fins is divided into two groups (2, 3), wherein the cooling fins within one group (2, 3) are parallel to each other, but form an angle (a) with the cooling fins of the second group (2), which is between 45 degrees and 135 degrees, preferably between 75 degrees and 115 degrees. Both groups (2, 3) of cooling fins are separated from each other by a fin-free area (4), wherein the fin-free area (4) extends along an axis of symmetry (S) of the plurality of cooling fins and its width decreases continuously along the axis of symmetry (S).