Angled Dual-Carrier Semiconductor Module Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor modules face challenges in efficient cooling due to increasing power densities of semiconductor chips, requiring an improved cooling concept to prevent overheating.
Innovation Solution
The semiconductor module design incorporates a first and second carrier with angled cooling surfaces that form an angle greater than 0° but less than 180°, allowing for enhanced thermal contact with a heat sink, and includes external leads and a heat sink with corresponding angled contact surfaces for improved heat transfer, along with various attachment methods such as spring clips and screws for secure contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional single-sided cooling is used, then device complexity is low, but cooling efficiency is insufficient for high power densities
Solution Approach 1:
The semiconductor module is divided into two separate carriers, each with its own cooling surface, allowing independent cooling paths for different semiconductor chips. This segmentation enables each carrier to be optimized for specific cooling requirements while managing high power densities effectively.
Solution Approach 2:
The patent transitions from single-sided cooling to dual-sided cooling by utilizing both the front and back sides of the base plate for heat dissipation. This dimensional change in the cooling architecture doubles the available cooling surface area and improves overall cooling efficiency.
2Productivity
If power density of semiconductor chips is increased, then productivity is improved, but thermal management becomes more difficult
Solution Approach 1:
By separating high-power semiconductor chips onto individual carriers with dedicated cooling surfaces, the patent enables targeted thermal management. Each carrier can be optimized for its specific thermal load, allowing higher power densities without compromising heat dissipation capability.
3Productivity
If dual carrier design is implemented, then cooling efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The modular two-carrier design allows each carrier to be manufactured and tested independently before final assembly. This segmentation simplifies the manufacturing process by enabling parallel production of carrier components and reducing the complexity of thermal management system integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal contact and heat transfer between the semiconductor module and heat sink, effectively managing waste heat and preventing overheating, thereby improving the cooling efficiency of semiconductor modules.
Implementation Method 1
The first cooling surface (11) is arranged in a first plane (13), the second cooling surface (21) is arranged in a second plane (23)... Between the first cooling surface (11) and the first contact surface (31) and between the second cooling surface (21) and the second contact surface (32) thermal contacts are made
Data Source
AI summary
A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.