Angled Fin Assembly with Openings for Avionics Heat Dissipation

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Solution Overview

Problem

Avionics and electronics in aircraft face challenges in dissipating heat effectively due to increasing thermal production and power density, leading to thermal design limitations in performance and cooling efficiency.

Innovation Solution

The use of a fin assembly with angled orientations and openings to enhance heat transfer, where fins are designed to increase surface area and improve convective cooling by directing airflow and fluid flow paths, and manufactured using additive manufacturing techniques such as 3D printing for complex geometries.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional heat dissipation methods are used in avionics, then the system structure is simple and easy to manufacture, but the heat dissipation efficiency is insufficient and cannot meet increasing power density requirements

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidfin assembly structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The heat dissipation system is segmented into multiple functional components: base surface for heat conduction, multiple fins extending from the base for convection, and openings within fins for enhanced fluid flow. This segmentation allows each component to optimize its specific heat transfer function while collectively achieving superior overall heat dissipation efficiency that overcomes the limitations of traditional simple structures

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The fin assembly transitions from traditional two-dimensional flat fin structures to three-dimensional complex geometries with openings, angled orientations, and multi-face configurations. This dimensional evolution enables the fins to interact with fluid flow in multiple directions and planes, dramatically increasing the effective heat transfer surface area and convective cooling efficiency without proportionally increasing manufacturing complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If more heat dissipation surface area is added, then convective cooling efficiency improves, but the system weight increases

Engineering Contradiction:
Improveconvective cooling efficiencyVSAvoidfin assembly weight
Core Design Contradiction:
ProductivityVSWeight of moving object

Solution Approach 1:

The fin structure incorporates openings that create a porous-like configuration, allowing fluid to penetrate through the fin assembly rather than just flowing around external surfaces. This internal fluid penetration dramatically increases the effective heat transfer area within a compact volume, achieving high convective cooling efficiency without adding excessive weight compared to solid dense structures

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The fin assembly integrates multiple material properties and structural characteristics: thermally conductive materials for the base surface, geometrically optimized fin configurations for convection, and strategically placed openings for fluid distribution. This composite approach combines different heat transfer mechanisms (conduction, convection, and fluid penetration) to maximize cooling efficiency per unit weight

Inventive Principle:
Principle #40Composite materials

3Volume of moving object

If fins are tightly grouped to save space, then the avionics chassis space is optimized, but heat dissipation becomes more difficult

Engineering Contradiction:
Improveavionics chassis space utilizationVSAvoidheat dissipation capability
Core Design Contradiction:
Volume of moving objectVSProductivity

Solution Approach 1:

The fin assembly segments the heat dissipation function across multiple surfaces: base surface for direct heat conduction from the heat-producing component, and multiple fin surfaces extending in various directions for distributed convection. This segmentation allows tight grouping within the chassis while maintaining effective heat transfer pathways to surrounding air or coolant

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The fins utilize three-dimensional spatial configuration with openings and angled orientations that enable heat dissipation in multiple directions simultaneously. This multi-directional approach allows the fin assembly to fit within constrained chassis volumes while still providing adequate heat transfer surface area and fluid flow pathways, effectively decoupling space utilization from heat dissipation capability

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration achieves superior convective cooling efficiency, potentially increasing it by 5-10% or more, allowing for higher power density and efficient heat dissipation in constrained spaces, while reducing system weight.

Implementation Method 1

a base surface configured to transfer heat from a heat-producing component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The set of fins is configured to dissipate heat from a heat producing component to fluid adjacent the set of fins

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS10703490B2Method and apparatus for heat-dissipation in electronics
Publication Date: 2020.07.07 GE AVIATION SYSTEMS LLC
  • US10703490B2 patent drawing
  • US10703490B2 patent drawing
  • US10703490B2 patent drawing

AI summary

A method and apparatus for heat-dissipation utilizing a fin assembly including one or more fins organized on a wall or base surface. The fins can extend into a flow of fluid passing along the wall or base surface to convectively cool the fins, which can transfer heat from heat-producing components, such as electronics.