Angled Groove PIC Chips for Optical Fiber Integration
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Solution Overview
Problem
Current silicon photonics technologies face limitations in maximizing data density and optical signal transmission efficiency due to restricted edge utilization on photonics integrated circuit (PIC) chips, which hinders the integration of multiple optical fibers and efficient data communication.
Innovation Solution
The introduction of PIC chips with substrates featuring grooves angled at 30 to 60 degrees, preferably 45 degrees, along the edges to accommodate optical fibers, allowing for increased edge utilization and efficient optical signal transmission by enabling multiple points of entry/exit for optical signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical fibers are positioned along the edges of the substrate, then data density and transmission efficiency are improved, but the chip area is insufficient to accommodate multiple fibers without interference
Solution Approach 1:
The patent transitions from positioning optical fibers only along the perimeter edges to incorporating them at corner regions as well. This dimensional expansion allows fibers to be arranged in a multi-point configuration along the edges and corners, increasing the total number of fibers that can be accommodated without increasing the overall chip footprint area.
Solution Approach 2:
The edge regions of the substrate are divided into multiple discrete positioning points, including both edge centers and corner regions. This segmentation allows independent optimization of fiber positioning at each point, enabling multiple fibers to be integrated along the edges while maintaining proper spacing and avoiding interference.
2Productivity
If multiple optical fibers are integrated along the edges, then transmission efficiency is improved, but manufacturing precision requirements increase due to alignment sensitivity
Solution Approach 1:
The patent introduces dedicated groove structures as intermediary features that guide and position optical fibers along the substrate edges. These grooves act as mechanical mediators that simplify the alignment process by providing pre-defined pathways, reducing the sensitivity to precise manual alignment while still achieving high transmission efficiency through multiple fiber integration.
3Adaptability or versatility
If optical fibers are positioned at corner regions, then edge utilization is improved, but the complexity of groove formation increases
Solution Approach 1:
The groove formation process is designed to be universal, serving multiple functions: defining fiber positioning paths along the edges, providing mechanical support for the fibers, and establishing alignment references for corner region integration. This multi-functionality reduces the overall complexity by consolidating multiple requirements into a single groove formation process.
Data Source
AI summary
The disclosed subject matter relates generally to photonic integrated circuit chips, semiconductor assemblies or packagings, and a method of forming the same. More particularly, the present disclosure relates to placement of optical fibers on a photonics chip, and a semiconductor assembly including the photonics chip.