Angled Heat Sink Base for On-Board Connector Cooling
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Solution Overview
Problem
Current heat dissipation methods for electronic and opto-electronic components, such as heat sinks, are not sufficient to efficiently manage the high heat generated by these components, particularly in compact systems like high-density servers, which can lead to overheating and system performance degradation.
Innovation Solution
The method involves using a heat sink with a base and upwardly extending elements, where cooling air is blown at an angle relative to the heat sink base, typically between 0 to 30 degrees, to enhance heat dissipation, and incorporating thermo-conductive bridges between heat-generating components and the heat sink, allowing for improved airflow and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If cooling air is blown horizontally (0 degrees) to the heat sink base, then the heat dissipation structure is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent changes the air flow angle parameter from 0 degrees (horizontal) to between 10-30 degrees (inclined), which significantly improves heat dissipation efficiency by creating better turbulence and heat transfer at the heat sink surface while maintaining structural simplicity
2Loss of energy
If the air flow angle is increased to improve heat dissipation, then heat dissipation efficiency is improved, but the system complexity increases
Solution Approach 1:
The patent achieves improved heat dissipation through a simple parameter change (air flow angle of 10-30 degrees) that can be implemented by basic structural design or fan positioning without requiring complex control systems, variable speed motors, or active adjustment mechanisms
Solution Approach 2:
The patent applies local quality improvement by focusing the inclined air flow specifically at the heat sink base surface where heat transfer is most critical, rather than uniformly cooling the entire component, thereby achieving efficient heat dissipation with minimal system complexity
3Volume of stationary object
If conventional heat sinks are used in high density servers, then space is constrained, but heat dissipation capacity is insufficient
Solution Approach 1:
The patent achieves nearly double the heat dissipation capacity by changing the air flow angle parameter to 10-30 degrees, allowing conventional heat sink designs to perform optimally within the constrained space of high density servers without requiring larger or more complex cooling systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach nearly doubles heat dissipation efficiency, reducing thermal resistance by half and maintaining effectiveness up to 30 degrees, thereby improving the reliability and performance of electronic and opto-electronic components by effectively managing heat in constrained spaces.
Implementation Method 1
The heat sink base acts as the primary conduction path for heat generated by the electronic component
Implementation Method 2
The heat sink pins or fins dissipate heat and create turbulence in air blown through the heat sink pins
Implementation Method 3
The heat sink pins or fins dissipate heat and create turbulence in air blown through the heat sink pins
Data Source
Figure 1
Figure 2~4
Figure 3
AI summary
Electronic or opto-electronic on-board connector (1, 30) and method to dissipate heat from such a connector. The connector is positioned within the scope of a cooling air flow (A). The component comprises a heat sink (20, 33) with a heat sink base (21, 34) carrying a plurality of upwardly extending elements, such as pins (22) or fins (35). The heat sink base makes an angle (α) with the flow direction (A) of the cooling air flow.