Angled Semiconductor Interposer for Lateral-Side Electrical Routing
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Solution Overview
Problem
Conventional semiconductor interposers are limited in their ability to make electrical connections with electronic components mounted on their lateral sides, as they typically only facilitate connections between components at the top and bottom surfaces.
Innovation Solution
The semiconductor interposer structure incorporates a body with multiple lateral surfaces, each connected at angles, and a network of electrical contacts on these surfaces, allowing for electrical connections between components mounted on different lateral sides through an interconnection structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional interposer structure is used with connections only at top and bottom surfaces, then the structure is simple, but the packaging density and functionality are limited
Solution Approach 1:
The patent extends electrical connections from traditional top-bottom surfaces to lateral surfaces of the interposer. By adding electrical contacts on side surfaces and implementing interconnections along lateral directions, the designutilizes additional spatial dimensions for component mounting and electrical routing, thereby increasing packaging density without fundamentally complicating the core interposer structure
Solution Approach 2:
The interposer is designed to serve multiple functions: it provides electrical interconnection between components on opposite surfaces, enables lateral connections between components on adjacent surfaces, and supports mixed configurations of top, bottom, and lateral component mounting. This multi-functional capability increases versatility while maintaining a relatively straightforward structural implementation
2Adaptability or versatility
If electrical contacts are added on lateral surfaces, then connectivity to lateral components is enabled, but manufacturing complexity increases
Solution Approach 1:
The interposer structure is divided into distinct functional regions: top surface contacts, bottom surface contacts, and lateral surface contacts. Each region can be independently configured and manufactured, allowing flexible implementation of electrical connections without requiring complete redesign of the entire interposer structure
Solution Approach 2:
Electrical contacts are extended onto lateral surfaces of the interposer, enabling direct electrical connection to components mounted on vertical or side surfaces. This dimensional extension adds connectivity capability while using standard semiconductor fabrication techniques for forming conductive traces and contacts on multiple surfaces
Data Source
AI summary
A semiconductor device is provided. The semiconductor device includes a body and an interconnection structure. The body has a first lateral surface and a second lateral surface angled relative to the first lateral surface. The interconnection structure is configured to make electrical connection between the semiconductor device and a first electronic component mounted to the first lateral surface of the body of the semiconductor device and to make electrical connection between the semiconductor device and a second electronic component mounted to the second lateral surface of the body of the semiconductor device.