Angled Lead Frame Optoelectronic Component for Parallel Light Emission

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Solution Overview

Problem

Existing optoelectronic components that emit light parallel to a mounting plane often require internal reflection elements for beam deflection, leading to inefficiencies and potential shadowing effects.

Innovation Solution

A method for producing an optoelectronic component involving a lead frame with angled portions, where the semiconductor chip is embedded in an inner mold body and outer mold body, allowing electromagnetic radiation to emit non-perpendicularly to the mounting plane without internal deflection, and using a potting material to protect the chip and contacts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If internal reflection elements are used for beam deflection to achieve parallel light emission, then light emission direction is controlled, but emission efficiency decreases due to internal deflection losses

Engineering Contradiction:

Improveemission efficiencyVSAvoidinternal reflection elements

Core Design Contradiction:

Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The invention removes the internal reflection elements from the component structure entirely. By extracting this unnecessary element, the patent eliminates the associated energy losses and simplifies the device while achieving the desired parallel light emission through the lead frame geometry alone.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of using internal reflection to deflect light parallel to the mounting plane, the invention inverts the approach by using the lead frame itself as a reflective surface. The light is deflected at the boundary between the semiconductor chip and the lead frame, achieving parallel emission without internal reflection elements.

Inventive Principle:

Principle #13The other way round (Inversion)

2Use of energy by moving object

If the lead frame is bent at 90 degrees to achieve parallel light emission, then emission direction is optimized, but shadowing effects may occur

Engineering Contradiction:

Improveemission efficiencyVSAvoidshadowing effects

Core Design Contradiction:

Use of energy by moving objectVSObject-generated harmful factors

Solution Approach 1:

The invention applies different geometric configurations to different portions of the lead frame. The first portion is bent at 90 degrees to optimize light emission direction, while the second portion remains in the original plane to avoid shadowing. This local differentiation allows each region to serve its optimal function.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent utilizes three-dimensional spatial arrangement by bending the lead frame in multiple planes. The first portion extends in one dimension while the second portion extends in another dimension, allowing light to emit parallel to the mounting plane without being blocked by the lead frame structure.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If the semiconductor chip is exposed without embedding material, then manufacturing is simplified, but the chip is vulnerable to external damage

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidchip protection

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The invention embeds the semiconductor chip within the lead frame structure, nesting the chip inside the protective enclosure formed by the bent lead frame portions. This nested configuration provides mechanical protection while maintaining a compact, integrated structure that is relatively simple to manufacture.

Inventive Principle:

Principle #7Nested doll (Nesting)

4Manufacturing precision

If the lead frame portions are not cut before bending, then structural integrity is maintained, but bending precision decreases

Engineering Contradiction:

Improvebending precisionVSAvoidlead frame integrity

Core Design Contradiction:

Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The patent divides the lead frame into distinct segments or portions that can be independently processed. By cutting the lead frame into separate portions before bending, each portion can be precisely formed without interference from other parts, improving bending precision while the subsequent assembly restores overall structural integrity.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20240072222A1Method for producing an optoelectronic component, and optoelectronic component

Publication Date: 2024.02.29 AMS OSRAM INT GMBH

AI summary

A method for producing an optoelectronic component comprises steps for providing a lead frame, which has a front side and a back side; for forming an inner shaped body, a first portion of the lead frame being embedded in the inner shaped body and a second portion of the lead frame not being embedded in the inner shaped body; for placing an optoelectronic semiconductor chip onto the inner shaped body on the front side of the lead frame; for bending the lead frame such that the first portion of the lead frame is angled with respect to the second portion of the lead frame; and for embedding the lead frame and the inner shaped body in an outer shaped body such that electromagnetic radiation emitted by the optoelectronic semiconductor chip runs through the outer shaped body.