Angled LED Sub-Mount Optical Axis Adjustment

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Solution Overview

Problem

Conventional sub-mounts for light-emitting diodes (LEDs) cannot adjust the optical axis to non-perpendicular angles relative to the mounting surface, requiring additional optical elements like lampshades to change the light output angle, which increases costs.

Innovation Solution

An electronic component sub-mount with a body having a top surface, a bottom surface, and a supporting surface at an angle greater than 0 degrees, featuring a first conductive layer on the bottom surface and a second conductive layer on the supporting surface, allowing the optical axis of the LED to form a specific angle without additional optical elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a conventional sub-mount with parallel supporting surface and bottom surface is used, then the structure is simple and manufacturing is easy, but the optical axis of the LED cannot be adjusted to non-perpendicular angles

Engineering Contradiction:
Improveoptical axis angle adjustmentVSAvoidsub-mount structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The supporting surface is designed to be inclined relative to the bottom surface, creating an asymmetric structure that enables the LED optical axis to be positioned at non-perpendicular angles to the mounting surface. This asymmetric geometry directly provides angular adjustment capability without requiring additional optical elements.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The invention introduces a angular dimension by inclining the supporting surface at a specific angle (e.g., 45 degrees) relative to the bottom surface. This dimensional change allows the LED to emit light at angled directions while maintaining a planar mounting interface on the circuit substrate.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If additional optical elements like lampshades are used to change light output angle, then the optical axis angle can be adjusted, but the cost increases

Engineering Contradiction:
Improvelight output angleVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The angular adjustment function is merged into the sub-mount structure itself through the inclined supporting surface. This integration eliminates the need for separate optical elements like lampshades, reducing component count and manufacturing cost while achieving the same light direction control.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the angular adjustment function from separate optical elements and incorporates it directly into the sub-mount's geometric structure. This extraction eliminates unnecessary components and reduces overall system cost.

Inventive Principle:
Principle #2Taking out (Extraction)

3Adaptability or versatility

If the second conductive layer has the same pin layout on both supporting surface and top surface, then the manufacturing process is simpler, but compatibility with different electronic component designs is reduced

Engineering Contradiction:
Improvecomponent compatibilityVSAvoidconductive layer layout
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The second conductive layer is designed with different pin layouts at different locations: the supporting surface has a first pin layout matching the LED component, while the top surface has a second pin layout matching the circuit substrate. This local differentiation enables compatibility with multiple component designs without increasing overall manufacturing complexity.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20250203780A1Electronic device including electronic component sub-mount
Publication Date: 2025.06.19 ENNOSTAR CORP
  • US20250203780A1 patent drawing
  • US20250203780A1 patent drawing
  • US20250203780A1 patent drawing

AI summary

An electronic device includes an electronic component module coupled to a substrate. The electronic component module includes a sub-mount, which includes a body having a top surface, a bottom surface, and a supporting surface. The supporting surface is located between the supporting surface and the bottom surface. A first conductive layer is disposed on the bottom surface and includes first conductive lines. A second conductive layer is disposed on the supporting surface, extending to the top surface, and includes second conductive lines. The second conductive lines on the supporting surface have a first pin layout, and the second conductive lines on the top surface have a second pin layout different from the first pin layout. The second pin layout matches the pin layout of first conductive lines on the bottom surface. An electronic component is coupled to the second conductive lines on the supporting surface.