Angled LED Sub-Mount With Dual Pin Layout Alignment
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Solution Overview
Problem
Conventional sub-mounts for light-emitting diodes (LEDs) cannot adjust the optical axis to non-perpendicular angles relative to the mounting surface, requiring additional optical elements like lampshades to change the light output angle, which increases costs.
Innovation Solution
An improved electronic component sub-mount with a body having a top surface, a bottom surface, and a supporting surface at an angle greater than 0 degrees, featuring a first conductive layer on the bottom surface and a second conductive layer on the supporting surface, allowing the optical axis of the LED to form a specific angle without additional optical elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional sub-mount design is used, then the structure is simple and cost is low, but the optical axis cannot be adjusted to non-perpendicular angles requiring additional optical elements
Solution Approach 1:
The sub-mount employs an asymmetric supporting surface that is inclined relative to the bottom surface, creating a specific angle (e.g., 45 degrees) between them. This asymmetric geometric configuration enables the optical axis of the mounted light-emitting diode to form a non-perpendicular angle with the mounting surface, eliminating the need for additional optical elements like lampshades while maintaining structural simplicity
Solution Approach 2:
The invention introduces an angular dimension by inclining the supporting surface at a specific angle relative to the bottom surface. This dimensional change in the sub-mount structure allows the optical axis to be oriented at non-perpendicular angles without adding complex optical components, thus resolving the contradiction between adaptability and device complexity
2Adaptability or versatility
If additional optical elements are added to change light output angle, then optical axis angle can be adjusted, but cost increases
Solution Approach 1:
The invention merges the optical axis angle adjustment function directly into the sub-mount structure through the inclined supporting surface. By integrating this angular adjustment capability into the base sub-mount rather than adding separate optical elements, the manufacturing cost is reduced while maintaining the ability to change light output angles for different application requirements
3Adaptability or versatility
If single pin layout is used, then the structure is simple, but compatibility with different electronic component designs is limited
Solution Approach 1:
The sub-mount incorporates dual conductive layers with different pin layouts (first and second pin layouts) to provide universal compatibility with various electronic component designs. The first conductive layer with first pin layout and the second conductive layer with second pin layout allow the same sub-mount to interface with different component types, enhancing versatility without significantly increasing structural complexity
Data Source
AI summary
An electronic component sub-mount includes a body having a top surface, a bottom surface, and a supporting surface. The top and bottom surfaces are located on opposite sides of the body. The supporting surface is located on one side of the body, and an angle that is not equal to 0 degrees is formed between the supporting surface and the bottom surface. A first conductive layer is disposed on the bottom surface and includes multiple first conductive lines. A second conductive layer is disposed on the supporting surface, extending to the top surface, and includes multiple second conductive lines. The second conductive lines on the supporting surface have a first pin layout, and the second conductive lines on the top surface have a second pin layout different from the first pin layout. The second pin layout matches the pin layout of first conductive lines on the bottom surface.