Angled Meshed Patch Antenna Arrays With Shared IC Feed
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Solution Overview
Problem
Mobile computing devices with multiple antenna arrays face high insertion losses and increased costs due to the use of multiple phase array ICs and cables for signal transmission, which is undesirable for meeting spatial coverage requirements.
Innovation Solution
Implementing a meshed patch structure in the antenna arrays, allowing a single IC to drive multiple arrays, reducing the need for dedicated phase array ICs and cables, and angling the planes of the arrays to optimize signal transmission through non-metallic portions of the device housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple phase array ICs and cables are used to connect antenna arrays to the main logic board, then spatial coverage requirements can be met, but insertion losses increase and production costs increase
Solution Approach 1:
The patent merges multiple antenna arrays onto a single substrate with a shared feed network, eliminating the need for separate phase array ICs and cables for each array. This integration reduces the number of connection points and cable interfaces, directly reducing insertion losses while maintaining the spatial coverage capability through the combined array architecture.
Solution Approach 2:
The patent implements a universal feed network that serves multiple antenna arrays simultaneously. The single phase array IC and shared cable infrastructure can control and feed all antenna arrays, making the system multi-functional. This universal approach reduces the total number of components needed while preserving the ability to achieve spatial coverage requirements through coordinated operation of multiple arrays.
2Reliability
If multiple phase array ICs and cables are used to connect antenna arrays to the main logic board, then spatial coverage requirements can be met, but production costs increase
Solution Approach 1:
The patent combines multiple antenna arrays into a single integrated module on one substrate, reducing the total component count. By merging the feed networks and using a single phase array IC, the patent eliminates the need for multiple separate ICs and cables, directly reducing production costs while maintaining spatial coverage through the integrated multi-array design.
Solution Approach 2:
The patent creates a universal antenna module where a single phase array IC and shared cable infrastructure can control multiple antenna arrays. This multi-functional design reduces the number of expensive components needed (fewer ICs and cables) while maintaining the capability to meet spatial coverage requirements through coordinated operation of the multiple arrays within the universal module.
3Power
If antenna arrays are connected through cables to the main logic board, then signal transmission can be achieved, but signal loss increases
Solution Approach 1:
The patent extracts the antenna arrays from the traditional cable-connected architecture and integrates them directly onto a single substrate with a shared feed network. By taking out the intermediate cable connections and integrating the arrays closer to the phase array IC, the patent reduces the transmission path length and eliminates cable-related signal losses while maintaining full signal transmission capability.
4Adaptability or versatility
If multiple dedicated phase array ICs are used for each antenna array, then each array can be independently controlled, but device complexity increases
Solution Approach 1:
The patent implements a universal phase array IC that can control multiple antenna arrays through a shared feed network. This single multi-functional IC replaces multiple dedicated ICs, reducing device complexity by eliminating redundant components. The IC maintains the ability to independently control each array through its multiple output channels, preserving adaptability while simplifying the overall system architecture.
Data Source
AI summary
An example wireless communication device includes a multi-layer substrate; and an antenna array having planes formed by features of the multi-layer substrate, wherein the features of the multi-layer substrate that form the planes of the antenna array include a plurality of vias and a plurality of traces arranged in a mesh structure, and wherein an angle between the planes of the antenna array and layers of the multi-layer substrate is greater than zero and less than 90.