Angled Optical Interconnect Modules for Spine-Leaf Latency
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Solution Overview
Problem
Traditional three-tier switching architectures in data centers lead to inefficiencies and increased network latency as the data center scales out, particularly for 'east-west' traffic, due to unpredictable routing pathway distances.
Innovation Solution
The implementation of high-capacity optical interconnect modules with angled housing and multifiber connectors that optically connect spine and leaf switches via a mesh wiring scheme, ensuring consistent latency and efficient data transmission across the network.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If three-tier switching architecture is used, then network reliability is improved through switch redundancy, but network latency increases and scales out inefficiently for east-west traffic
Solution Approach 1:
The patent segments the network into distinct spine and leaf layers, where spine switches handle inter-layer connectivity and leaf switches handle intra-layer traffic. This segmentation creates predictable routing paths for east-west traffic within the same layer, reducing latency while maintaining reliability through the segmented architecture's design
Solution Approach 2:
The patent transitions from a three-tier hierarchical model to a two-tier spine-leaf model, adding a dimensional simplification that flattens the network architecture. This dimensional change eliminates intermediate routing layers for same-layer traffic, reducing latency while preserving reliability through direct spine-leaf connections
2Productivity
If data center is scaled out to accommodate increased traffic volume, then data-processing capacity is improved, but network latency increases due to unpredictable routing pathways
Solution Approach 1:
The patent applies local quality by creating uniform latency characteristics within each layer. All leaf switches are positioned at the same distance from spine switches, ensuring consistent latency for east-west traffic. This local uniformity allows the network to scale out while maintaining predictable latency performance
Solution Approach 2:
The patent changes the routing parameter from unpredictable multi-path routing to deterministic shortest-path routing through the spine-leaf architecture. By standardizing the network topology parameters (equal distances from leaves to spines), the system achieves scalable capacity with consistent latency characteristics
3Adaptability or versatility
If conventional three-tiered model is used, then network scalability is achieved through redundancy, but routing pathway distances become unpredictable leading to efficiency losses
Solution Approach 1:
The patent implements equipotentiality by ensuring all leaf switches are at equal distance from spine switches, creating a uniform network potential landscape. This equipotential design ensures predictable routing distances and efficient east-west traffic flow, enabling scalability without the efficiency losses of conventional models
Solution Approach 2:
The patent uses copying by replicating the spine-leaf connection pattern across all switches. Each leaf switch has identical connections to multiple spine switches, creating redundant yet uniform routing paths. This copying approach enables scalability through redundancy while maintaining network efficiency through consistent routing distances
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution facilitates scalable and efficient large-scale spine and leaf topologies, reducing network latency and increasing overall data center performance by maintaining consistent connection times and utilizing all routes simultaneously.
Implementation Method 1
Each connector of the first plurality of multifiber connectors disposed on the front-facing portion is optically connected to each connector of the first plurality of multifiber connectors disposed on the rear-facing portion via at least a pair of optical fibers
Data Source
AI summary
An optical interconnect module comprises a housing including a front-facing portion that includes a first face and a second face, wherein the first face of the front-facing portion is angled relative to the second face of the front-facing portion. The housing also includes a rear-facing portion opposing the front facing portion, the rear-facing portion including a first face and a second face, wherein the first face of the rear-facing portion is angled relative to the second face of the rear-facing portion. The housing further includes an internal chamber disposed between the front-facing portion and the rear-facing portion. A first plurality of multifiber connectors is disposed on the front-facing portion of the housing, and a first plurality of multifiber connectors disposed on the rear-facing portion of the housing. Each connector of the first plurality of multifiber connectors disposed on the front-facing portion is optically connected to each connector of the first plurality of multifiber connectors disposed on the rear-facing portion by at least a pair of optical fibers.