Angled Orthogonal Inductors for Higher Inductance in Less Chip Area
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Solution Overview
Problem
Conventional in-plane inductors occupy a significant portion of the Si chip area, limiting space for other components and requiring a dielectric layer, which can be inefficient in terms of area utilization and inductance.
Innovation Solution
Inductors are placed at an angle relative to the functional chip, allowing them to occupy less than 50% of the chip area while increasing inductance and enabling power and signal delivery, with magnetic elements optimized for flexible volume versus dimensional area tradeoffs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If in-plane inductors are used on Si chip, then inductance can be provided, but more than 50% of the chip area is occupied
Solution Approach 1:
The patent transitions from planar in-plane inductors to three-dimensional angled inductors that extend vertically from the chip surface. By tilting the inductor structure at an angle relative to the chip plane, the design utilizes the vertical dimension to increase inductance while reducing the horizontal footprint on the chip area.
Solution Approach 2:
The inductor structure is nested within a three-dimensional configuration where the coil windings are arranged at an angle, allowing the magnetic core to be positioned within or adjacent to the coil structure. This nested arrangement maximizes the use of space to achieve higher inductance in a compact volume.
2Device complexity
If in-plane inductors are used, then inductance is provided, but dielectric layer is required between Si substrate and components
Solution Approach 1:
The patent extracts the inductor structure from the planar Si chip surface and positions it in a three-dimensional angled configuration. This extraction eliminates the need for thick dielectric layers between the Si substrate and inductor components, as the inductor is now positioned above the chip surface at an angle rather than lying flat on it.
Solution Approach 2:
By moving the inductor into the vertical dimension and positioning it at an angle, the design bypasses the constraint of requiring dielectric layers for planar component placement. The angled configuration allows direct mounting or reduced dielectric requirements while maintaining electrical isolation and performance.
3Area of moving object
If angled inductors are used, then area usage is reduced to less than 50%, but inductance must be maintained or increased
Solution Approach 1:
The angled inductor design exploits the vertical dimension to compensate for reduced horizontal area. By extending the coil structure vertically at an angle, the effective length of the magnetic path increases, thereby maintaining or enhancing inductance despite the smaller footprint on the chip surface.
Solution Approach 2:
The patent employs composite structures combining magnetic core materials with the coil windings in a three-dimensional arrangement. This composite configuration optimizes the magnetic flux path and increases inductance density, allowing high inductance values to be achieved in a compact angled structure that occupies less than 50% of the chip area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for increased inductance and efficient power/signal delivery with reduced area usage, supporting clocking, power rails, and voltage regulation, and enabling flexible tradeoffs in volume and height.
Implementation Method 1
a looped planar metal coil forming an inductor on the first planar surface
Implementation Method 2
each the conductive wire trace of the insulating substrate edge adapted to electrically connect to a respective connective pad via a conductive connector
Data Source
AI summary
An apparatus including a plurality of vertically oriented insulating substrates, each substrate having a planar surface including a looped metal coil structure forming a planar inductor. Each of the substrates and formed planar inductors arranged in parallel and oriented vertically and adjacent each other in a series configuration for increased inductance. The formed inductor and substrate disposed vertically with respect to a horizontal axis and is inclined at an angle with respect to a vertical axis, the angle ranging between less than 90 degrees and greater than 0 degrees. A first magnetic material plate is disposed adjacent the planar inductor at a first planar surface of the substrate, and a second magnetic material plate disposed adjacent a second planar surface having a conductive trace connecting one end of the planar inductor, each first and second plate extending to limit a spatial extent of the magnetic fields created by the inductor.