Angled Patch Panel Assembly for Cable Length Reduction

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Solution Overview

Problem

The increasing demand for copper and other precious metals drives up costs for coaxial cables used in patch panels, leading to higher equipment costs due to strain on the global metal supply chain, and existing patch panel designs do not efficiently manage cabling, resulting in longer infrastructure cabling requirements.

Innovation Solution

A three-dimensional angled patch panel assembly with a unitary structure comprising first and second panel elements and a third panel element, featuring apertures and flange members for secure mounting, which reduces cabling length by clustering ports near the edge and providing an air dam for improved airflow, thereby minimizing cabling needs and thermal management issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If traditional patch panels use standard port locations and cable routing, then ease of installation is maintained, but infrastructure cabling length increases leading to higher costs

Engineering Contradiction:
Improvecopper consumptionVSAvoidinstallation complexity
Core Design Contradiction:
Loss of substanceVSEase of manufacture

Solution Approach 1:

The patent introduces a three-dimensional angled design where patch panel elements are positioned at angles (e.g., 45 degrees) relative to the rack face, creating vertical and horizontal offsets. This dimensional change allows cables to route more directly from ports to equipment, reducing overall cable length by approximately 4.5 inches per port while maintaining standard installation procedures through the use of angled mounting brackets and repositioned apertures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If patch panels are mounted flat against the rack, then manufacturing simplicity is maintained, but airflow and thermal management are insufficient

Engineering Contradiction:
Improvethermal managementVSAvoidpanel structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent creates vertical separation between patch panel elements by mounting them at angles, which opens up airflow channels behind and between panels. This three-dimensional configuration allows cooling air to circulate more effectively through the rack, removing heat from equipment while the modular angled design keeps structural complexity manageable through standardized bracket systems.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent divides the patch panel into multiple separate elements (first patch panel element, second patch panel element, third patch panel element) that can be independently mounted at different angles and positions. This segmentation allows each element to be optimized for both thermal access and cable routing, with gaps between elements serving as airflow channels while maintaining organizational structure.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS9247319B2Panel assembly
Publication Date: 2016.01.26 CISCO TECHNOLOGY INC
  • US9247319B2 patent drawing
  • US9247319B2 patent drawing
  • US9247319B2 patent drawing

AI summary

In one example embodiment, a panel assembly is provided that includes a first panel element having a first side edge to be attached to a communications rack, where the first panel element includes a first plurality of apertures proximate to the first side edge. The panel assembly also includes a second panel element having a second side edge to be attached to the communications rack, where the second panel element includes a second plurality of apertures proximate to the second side edge. The panel assembly also includes a third patch panel element provided between the first panel element and the second panel element.