Array Antenna PCB Structure for Beam Diversion Near Metal Housing
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Solution Overview
Problem
Next-generation wireless communication devices using millimeter waves face challenges with high free-space loss and deteriorated radiation performance due to the proximity of array antennas to metal housing components, leading to beam deviation and performance degradation.
Innovation Solution
The electronic device incorporates a housing design with angled printed circuit boards and conductive patterns to redirect beam directions away from metal components, ensuring optimal radiation performance by electrically connecting these boards to a wireless communication circuit for signal transmission and reception.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If array antennas are mounted inside electronic device housing, then device integration is improved, but radiation performance deteriorates due to proximity to metal components
Solution Approach 1:
The patent applies asymmetry by designing the printed circuit board with conductive patterns in non-symmetric orientations. Specifically, the first conductive pattern is oriented at a first angle relative to the first plate, while the second conductive pattern is oriented at a second angle, creating asymmetric beam directions that deliberately avoid metal housing portions. This asymmetric configuration resolves the contradiction by enabling integrated antenna placement while maintaining radiation performance through directional beam steering away from interfering metal structures.
Solution Approach 2:
The patent employs dimensionality change by utilizing angular orientation in the horizontal plane (xy-plane) to diversify beam directions. Instead of merely positioning antennas at different vertical heights or horizontal locations, the invention introduces a new degree of freedom by varying the angular orientation of conductive patterns relative to the housing plates. This allows multiple beams to be generated in different directions within the same spatial footprint, resolving the integration-performance contradiction.
2Power
If multiple antennas are arranged at regular intervals, then antenna gain increases, but beam deviation toward metal portions causes performance deterioration
Solution Approach 1:
The patent applies local quality by assigning different angular orientations to different conductive patterns on the printed circuit board. Each conductive pattern (first and second patterns) is oriented at a specific angle relative to the first plate, creating localized beam directions tailored to avoid metal portions. This local differentiation in orientation allows each antenna element to optimize its beam direction independently, resolving the contradiction between achieving high gain through multiple antennas and preventing beam deviation toward metal structures.
3Length of moving object
If electronic devices are made slimmer, then device portability improves, but array antenna placement near metal housing deteriorates radiation performance
Solution Approach 1:
The patent resolves the slimness-performance contradiction by introducing angular orientation as an additional dimension for beam control. Instead of requiring increased vertical spacing between antennas and metal housing (which would increase device thickness), the invention uses angular diversification of beam directions in the horizontal plane to avoid metal portions. This allows slim device design while maintaining radiation performance through directional control rather than spatial separation.
Data Source
AI summary
An electronic device comprising an array antenna according to various embodiments of the present invention may comprise: a housing comprising a first plate, a second plate facing away from the first plate, and a side member surrounding the space between the first plate and the second plate; a display visible through a part of the first plate; a first printed circuit board comprising a first surface facing the side member, a second surface facing away from the first surface, a first edge adjacent close to the first plate, and a second edge closer to the second plate than the first edge, the first printed circuit board comprising one or more conductive plates on the first surface; a second printed circuit board extending from the first edge so as to bend at an obtuse angle with regard to the first surface, the second printed circuit board comprising one or more first conductive patterns; a third printed circuit board extending from the second edge so as to bend at an obtuse angle with regard to the first surface, the third printed circuit board comprising one or more second conductive patterns; and a wireless communication circuit electrically connected to the conductive plates, the first conductive patterns, and the second conductive patterns and configured to transmit and/or receive signals. Various other embodiments may be possible.