Angled PCB Arrangement for Vibration Stress Reduction
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Solution Overview
Problem
Measuring devices in process automation are susceptible to mechanical stresses from vibrations and temperature effects, leading to potential damage to electronic components, particularly due to inadequate housing designs that do not effectively mitigate these stresses.
Innovation Solution
The printed circuit board is arranged at an angle to the orientation plane, differing from a multiple of 90°, and an encapsulated contact element is used to connect electronic devices within the housing, reducing mechanical stress through vector division and ensuring a seamless electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the printed circuit board is arranged parallel to the orientation plane (at 90° or 0° angles), then the electrical connection is simple and straightforward, but the mechanical stress from vibrations directly affects the contact points and solder joints
Solution Approach 1:
The patent applies asymmetry by orienting the printed circuit board at a specific angle (e.g., 45°) relative to the orientation plane formed by the first and second longitudinal axes. This asymmetric arrangement ensures that vibration forces acting along the longitudinal axes are distributed at oblique angles to the circuit board, preventing concentrated stress on solder joints and contact points while maintaining electrical functionality
2Reliability
If additional solder points are added at non-conducting locations to reduce temperature effects, then the electronic components are better protected, but the design and manufacturing effort increases significantly
Solution Approach 1:
The patent extracts the thermal management function from the mechanical mounting structure by using the angled circuit board arrangement itself to create thermal pathways. The oblique orientation naturally distributes thermal stresses away from critical electrical connections, eliminating the need for additional dedicated thermal solder points or heat sinks while maintaining component protection
3Temperature
If the housing uses long sections between the process and electronics to reduce temperature effects, then the electronic components are better protected, but the device size and complexity increase
Solution Approach 1:
The patent transitions from a one-dimensional solution (long housing sections along the process axis) to a three-dimensional solution by angling the printed circuit board relative to the orientation plane. This dimensional change allows thermal management to occur in multiple spatial directions simultaneously, reducing the required housing length while maintaining temperature protection through the angled thermal pathways created by the oblique board orientation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the impact of external mechanical stresses on electronic components, enhancing the durability and reliability of measuring devices by distributing vibration forces and maintaining a secure electrical connection.
Implementation Method 1
the printed circuit board is arranged in the housing such that the printed circuit board plane is arranged at an angle to the orientation plane, which differs from an integral multiple of 90°
Data Source
AI summary
A measuring device with at least one housing and at least one electronic unit, wherein the housing has at least one electronic access opening for the electronic unit, wherein a first longitudinal axis extends through the electronic access opening, wherein the housing has a sensor access opening for connecting to a sensor unit, wherein a second longitudinal axis extends through the sensor access, wherein the first longitudinal axis and the second longitudinal axis span an orientation plane, wherein the electronic unit has at least one printed circuit board which lies essentially in a printed circuit board plane that, to provide a measuring device, in which the effect of external mechanical stresses on electronic components can be reduced, is arranged in the housing such that the printed circuit board plane is at an angle relative to the orientation plane which differs from an integral multiple of 90°.